Applications Engineering Manager

About Syenta 

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste. 

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing. 

About the Role 

We are seeking an Application Engineering Manager to serve as the primary technical interface between Syenta’s advanced manufacturing technology and our global customer base.  

This is a high-impact, hybrid role requiring a blend of deep semiconductor technical expertise, project management discipline, and commercial acumen. You will translate complex customer requirements into actionable project proposals, oversee technical delivery, and build the foundational applications engineering team responsible for customer success.  

This role is critical to scaling Syenta’s customer engagements and strengthening our technical credibility in advanced packaging. 

Responsibilities 

Technical Sales Interface  

• Act as the lead technical expert during the pre-sales process  

• Conduct deep-dive discovery sessions to understand customer requirements, constraints, and pain points  

• Translate customer needs into technically viable and commercially aligned solutions  

Proposal Development  

• Design and develop detailed project proposals including scope, milestones, and technical approach  

• Ensure alignment between customer requirements and Syenta’s product capabilities  

• Own feasibility assessments across advanced packaging applications  

Project Management & Delivery  

• Oversee the full lifecycle of customer projects from kickoff through delivery  

• Ensure timelines, technical milestones, and deliverables are met  

• Maintain high ownership and accountability across all active projects  

Technical Escalations  

• Serve as the final escalation point for complex technical challenges  

• Work cross-functionally with R&D, process, and hardware teams to resolve issues  

• Maintain strong customer trust through effective problem resolution  

Customer Engagement & Presentation  

• Deliver technical presentations, demos, and updates to customer stakeholders  

• Interface with senior technical leaders (e.g., CTOs, Directors of Engineering)  

• Handle sensitive technical information with professionalism and discretion  

Team Leadership & Build-Out  

• Recruit, mentor, and manage a growing team of applications engineers  

• Establish best practices for customer interaction, documentation, and project tracking  

• Build scalable processes to support increasing customer demand 

Requirements 

Experience  

• 7+ years in Applications Engineering, Technical Sales, or Engineering Management  

• Background in high-tech industries such as semiconductors, advanced packaging, or electronics  

• Proven experience managing customer-facing technical projects  

Education  

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field  

Technical Expertise  

• Strong understanding of advanced semiconductor packaging, including:  

• 2.5D, 3D integration, FOWLP / FOPLP, Hybrid bonding, Bridge architectures  

• Familiarity with chip-last, chip-on-wafer/substrate processes  

• Experience with hardware/software integration, CAD/CAM tools, and system-level troubleshooting  

Communication & Customer Skills  

• Ability to clearly communicate complex technical concepts to both technical and non-technical audiences  

• Strong customer-facing experience, including presenting and managing se