Director of Process Engineering

Description

Job Purpose

The Director of Process Engineering is responsible for leading the unit process engineering teams (including Lithography, Etch, Thin Films, and CMP) to ensure tool capability, process stability, and operational excellence in the Fab. This role drives robust equipment utilization, statistical process control (SPC), and unit-level process optimizations to support high-yielding, scalable manufacturing. The Director collaborates closely with Process Integration to productize new technologies, manages vendor relationships for tool acquisitions, and provides 24/7 technical oversight to ensure continuous, high-volume production.

Essential Responsibilities

• Module Ownership & Scalability: Lead and manage the unit process engineering teams (Lithography, Etch, Thin Films, Diffusion, and CMP) to deliver stable, repeatable, and scalable manufacturing solutions.
• Process Control & Stability: Champion Statistical Process Control (SPC), Design of Experiments (DOE), and Failure Mode and Effects Analysis (FMEA) across all modules to reduce process variability, eliminate scrap, and maximize baseline yield.
• Tool Capability & Equipment Optimization: Partner with Maintenance and Equipment Engineering to optimize tool uptime, match chamber capabilities, and define rigorous preventative maintenance (PM) qualification criteria.
• Technology Transfer & NPI Support: Collaborate closely with the Process Integration team to source, develop, and qualify new unit processes required for New Product Introductions (NPI) and technology transfers into production.
• Continuous Improvement & Cost Reduction: Drive continuous improvement programs (CIP) centered on minimizing cycle time, improving raw process times, optimizing chemical/material consumption, and lowering overall wafer cost.
• Vendor & Capital Management: Lead technical evaluations for new equipment acquisition, manage vendor relationships, and oversee the installation, qualification, and start-up of new Fab tools.
• Executive & Cross-Functional Communication: Prepare and present module health metrics, capacity constraints, tool qualification timelines, and engineering updates to executive leadership and cross-functional stakeholders.
• Fab Engagement & Technical Escalation: Provide hands-on, high-level technical troubleshooting in the Fab for complex process excursions; support 24/7 production schedules to ensure minimal disruption to manufacturing lines.

Supervisory Responsibilities

• Accomplish department objectives by organizing, monitoring, and directing the work of unit process engineering managers and staff.
• Manage the full employee lifecycle for the process engineering team, including recruiting, onboarding, training, and professional development.
• Set clear, module-specific performance goals, monitor progress, and provide consistent engineering coaching and mentorship.

Competencies

• Technical Mastery: Deep, expert-level knowledge of advanced semiconductor unit processes, equipment capabilities, and the fundamental physics/chemistry of Fab tools.
• Operational Excellence: Proven track record in lean manufacturing, SPC management, tool-matching strategies, and high-volume manufacturing (HVM) line stabilization.
• Influence & Collaboration: Exceptional ability to align priorities and collaborate across Process Integration, Equipment Engineering, Operations, and Maintenance teams.
• Analytical Skills: Advanced data analysis capabilities using yield management software, statistical tools (JMP, Minitab, or equivalent), and data-driven root cause analysis.
• Adaptability & Leadership: Ability to lead a highly technical team through rapid scaling, tight production timelines, and complex technical excursions.

Requirements

Required Education and Experience

• Education: Master’s degree or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related scientific/engineering discipline.
• Industrial Experience: 8+ years of direct experience in Semiconductor/MEMS process engineering, specifically within a cleanroom/Fab manufacturing environment.
• Leadership: 3+ years of demonstrated experience managing technical engineering teams or unit module groups.
• Technical Proficiency: Comprehensive expertise in multiple unit processes, including but not limited to Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Atomic Layer Deposition (ALD), Dry/Wet Etch, Photo