Intern - Product Architecture

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

·         As a Compute and Networking Business Unit (CNBU) Product Architecture Engineer for DRAM at Micron Technology, you will have the opportunity to establish a deep understanding of Micron’s technologies and capabilities, as well as key market trends and competitive landscapes. You will be responsible for using that knowledge to define optimized DRAM solutions for AI training and inference. You will be responsible for building strong technical relationships with system architects and key technologists across the industry and will have the opportunity to represent Micron at technical conferences and consortia. Your role in those industry engagements will be to drive pathfinding discussions, influence design-in decisions and negotiate product requirements with our ecosystem partners and customers. Internally, you will partner with Micron’s top R&D, design, test, and product engineers to ensure successful implementation of new product concepts. Working closely with Product and Business Development Managers you will ensure that each technical decision is aligned with our business strategy, and ultimately help bring these outstanding new products to our customers! 
  

Job Responsibilities: 

·         Conduct system architecture exploration, analysis, and evaluation of architectures with partner groups using modeling, simulation, and prototyping tools  

·         Engage with customers and external partners to identify current system architecture bottlenecks and identify future innovations to mitigate bottlenecks 

·         Pathfinding to explore system architectures incorporating LPDDR and HBM memory technologies 

·         Pathfinding to explore memory features which increase the value proposition of DRAM in AI applications 

  

Successful candidate will have:  

·         Familiarity with memory architecture,

·         Good communication skills with the ability to grasp, distil and convey technical information

·         Exposure to semiconductor packaging technologies

·         Familiarity with SoC/ASIC design and understanding of memory hierarchy 

·         Ability to work collaboratively in a dynamic environment 

·         Bonus - Good understanding of Memory subsystem operation in high-performance computing applications 

·         Bonus – Exposure to HW/SW co-optimization and Regenerative AI frameworks 

·         Bonus – Exposure to JEDEC and specification setting process 

 

 Required Experience: 

·         Enrolled in B.S./M.S. in Electrical Engineering, Computer Engineering, or related field of study

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$33.23 - $46.16

Our salary ranges are determined by role, level, and location.  The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations.  Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training.  The pay scale is subject to change depending on business needs.  Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

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