Process Integration Engineer E3 Senior

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Salary:

$108,000.00 - $148,500.00

Location:

Albany,NY

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Applied Materials, Inc. is the global leader in materials engineering solutions used to produce virtually every advanced semiconductor chip and display in the world. Our unparalleled expertise in engineering materials at the atomic scale and transforming innovations into high-volume manufacturing enables customers to turn breakthrough ideas into reality. At Applied Materials, our innovations Make Possible® the technologies that are shaping the future.

Within the Office of the CTO, we are pioneering next-generation technologies that will drive energy-efficient computing and communications. Our team is developing innovative slow-and-wide photonic interconnect architectures to address the growing data movement bottleneck in AI data centers, leveraging Applied Materials’ leadership in photonics, heterogeneous integration, and advanced packaging technologies.

To accelerate this vision, we are seeking a passionate and innovative technologist with a strong semiconductor background to develop device architectures, process technologies, and integration solutions for emerging photonic platforms and future technology inflections. This role offers a unique opportunity to work at the forefront of semiconductor and photonics innovation, helping define the next generation of computing and communication systems.

Key Responsibilities

• Lead process integration for advanced semiconductor and photonic devices, enabling next-generation high-performance interconnect technologies

• Translate device architectures and design layouts into robust, manufacturable process flows across development and pilot manufacturing

• Drive C&F activities, including rapid proof-of-concept and prototyping builds

• Define and track critical process parameters and integration metrics; partner with module owners to optimize unit processes

• Drive yield improvement, SPC, and CIP across complex fabrication flows

• Conduct optical, electrical, and tolerance analyses to improve device efficiency, scalability, and manufacturability

• Collaborate cross-functionally with process engineering, product development, design, and production teams to accelerate technology development

• Engage with external vendors, partners and customers to support technology development, material selection, and process scaling

Minimum Qualifications

• Ph.D. in Electrical Engineering, Materials Science, Physics, or related discipline (Master’s degree with relevant industry experience will be considered)

• Strong experience in semiconductor process integration in leading fab / foundry

• Knowledges of semiconductor unit processes including lithography, etch, thin film deposition, metallization, implant, CMP, etc.

• Strong experience in yield analysis, metrology, and SPC implementation

• Proven ability to work effectively in matrixed, cross-functional teams

Preferred Qualifications

• Experience in heterogeneous integration of GaN and III/V material with Si platform

• Experience in photonic devices, co-packaged optics (CPO), or optical interconnect technologies

Key Competencies

• Demonstrated depth in building, debugging, and