CO-OP Technical Assistant (Advanced Lasercom)

Job Description

 

This 6-A internship is to develop architectures and designs for photonic integrated circuit (PIC) lasercom modems. PIC modems can provide significant size, weight, manufacturability, ruggedization, and cost improvements as compared to conventional discrete-component based modem designs. This project will investigate a range of topics that will help advance and mature PICs for the use in lasercom modems on mobile platforms. These topics include:

 

• • Modeling and simulation of optical modem functions in silicon and silicon-nitride PICs. This will entail transmitter, acquisition, and receiver functions.
  • Identifying and developing design approaches for lasers, modulators, transmitters, photo-receivers, variable optical attenuators, couplers, and filter devices required for a PIC modem.
  • Developing a road-map path for designing an ASIC+PIC to achieve a fully integrated electro-optical modem.
  • Investigation of feasibility of integrated semiconductor optical amplifier (SOA) devices for power amplification and pre-amplification. Evaluation of their suitability for burst-mode DPSK and coherent QPSK waveforms.

 

The successful candidate will be pursuing an undergraduate degree at MIT in Electrical Engineering and Computer Science or comparable major.

Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

 

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

 

Requisition ID: 41081