Product Engineer II

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high-performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Circuits’ products are used in a range of wired and wireless communications applications. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.

Mini-Circuits’ sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive website.    

Position Summary:The Product Engineer II is responsible for driving product release from design completion to manufacturing release by providing engineering support to plan & execute characterization, qualification and first production run of products. Additionally, the position is required to monitor the release status of products and ensure the yield and time-to-market targeted for the deployment to the market, ensure compliance with the Phase Gated Process, Engineering Change Order, and release processes. The Product Engineer will analyze and recommend improvements to production processes and methods to facilitate cost reduction and quality improvement, as well as communicate new manufacturing and logistics process requirements to key stakeholders and report on the status of the developments of the same. Further, the Product Engineer will be responsible for analysis and review of test data during and after product development, both to ensure fidelity of data and to assist in defining specifications for product releases. Salary Range: $103,000 - $153,000 per year Job Function:

• Support assigned active and passive catalog and customer special designs in the Radio Frequency (RF) range, and participate in product generation process reviews.
• Provide engineering support with the assistance of various departments for:
  • Components characterization and qualification.
  • Characterization, qualification and performance optimization of test fixtures, evaluation boards, and test setups.
  • Creation of test plans and block diagrams.
  • Drafting of first articles performance analysis.
• Assist in the efficient and cost-effective transition of design prototypes from engineering to production.
• Generate preliminary documentation required for catalog release.
• Participate in final design review meetings for all catalog and customer specials, and in first production run readiness reviews; support training of production personnel.
• Generate preliminary test, tune, and calibration procedures; assist with transition to production.
• Work alongside Project Management team to track technical developments according to established schedules and cost metrics.
• Collaborate with various company departments and stakeholders on preferred methodologies,
• Support and participate with engineering team through ISO audits and Management Review.
• Help to maintain the lab space; this includes but is not limited to:
  • Monitoring levels of supplies and initiating orders of material when required.
  • Coordination of equipment calibration and asset management.
  • Assisting with new equipment setup.

The duties, responsibilities and expectations described above are not a comprehensive list and additional tasks may be assigned to the member, within the scope of the position. Qualifications:

• Bachelor’s Degree + 5 years of experience in RF Product Design/Test, or related field, OR
• Master's Degree + 2 years of experience in RF Product Design/Test, or related field.
• Coursework/Previous Test Experience in the following areas (must have 3):
  • Amplifier Circuit Design (Low Noise and Power).
  • Electromagnetic Theory.
  • System Analysis.
  • S-Parameter based Network Analysis.
• Experience or coursework in microwave and RF hardware design, including electrical, mechanical, thermal and test, with a demonstrated ability to understand if measured results are correct and agree with the theory.
• Demonstrated ability (hands-on) to assemble, tune, test and troubleshoot hardware in a laboratory environment.
• MS Office Skills.
• Basic understanding of surface mount and microelectronic chip-and-wire manufacturing methods and techniques, including soldering, wedge bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods, and techniques.
• Theoretical and basic practical knowledge in the use