Jobs and Careers
AM
Sr. IC Packaging Design Engineer, DBF Silicon
Amazon.comSan Diego, United Statesfull_timeVerifiedPosted 24 Feb 2023
💰 $247,600/yr($127,300/yr – $247,600/yr)
About the role
Project Kuiper is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
Come work at Amazon!
The Role:
As Senior IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.
In this role you will:
· Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
· Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
· Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, WLCSP, QFN, etc.
· Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
· Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
· Assist the thermal team in defining and running thermal simulations of packages and PCBs.
· Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
· Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
· Bachelor's degree in Electrical / Communications Engineering or related field, or equivalent experience
· 7+ years of experience in RF design, preferably in an advanced node
· Proven track record where products have gone to volume production
· Experience with RF communication systems
· 10+ years of experience designing full-custom packages/PCBs for high performance chips.
· Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
· Strong understanding of power integrity fundamentals, including selection and optimization of passives in package
· Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
· Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, please visit https://www.amazon.jobs/en/disability/us.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $127,300/year in our lowest geographic market up to $247,600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. Applicants should apply via our internal or external career site.
Come work at Amazon!
The Role:
As Senior IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.
In this role you will:
· Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
· Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
· Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, WLCSP, QFN, etc.
· Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
· Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
· Assist the thermal team in defining and running thermal simulations of packages and PCBs.
· Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
· Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Basic Qualifications
· Bachelor's degree in Electrical / Communications Engineering or related field, or equivalent experience
· 7+ years of experience in RF design, preferably in an advanced node
· Proven track record where products have gone to volume production
· Experience with RF communication systems
Preferred Qualifications
· Bachelor’s degree in Electrical Engineering or other technical field.· 10+ years of experience designing full-custom packages/PCBs for high performance chips.
· Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
· Strong understanding of power integrity fundamentals, including selection and optimization of passives in package
· Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
· Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, please visit https://www.amazon.jobs/en/disability/us.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $127,300/year in our lowest geographic market up to $247,600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. Applicants should apply via our internal or external career site.
Apply for this role
Generate a tailored application kit with a matched cover letter, interview prep, and CV highlights — in under 60 seconds.
Apply Now →Generate Application KitFree account required — sign up in 30s