Job Details:

Job Description: 

Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.
 

This job requisition is to seek Sr. BEOL (Back-End-Of-Line) Process Integration Development Engineers for our FSM HVM Global Yield organization, reporting to the BEOL Process Integration Manager. Selected candidates will work with other members in BEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.
 

Sr. BEOL Process Integration Development Engineer's responsibilities include (but not limited to):

• Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.
• Collaborate with Technology Development and Local Yield teams to import new technology to production fabs.
• Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
• Perform feasibility studies, plan, and conduct experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product.
• Own NPI (New Product Introduction) in production fabs and perform product-specific process optimizations to meet foundry customers specifications and requirements.
• Own engineering projects in partnership with Local Yield teams to improve product yield, quality, device performance and to reduce wafer cost/improve fab efficiency.
• Engineering support for technical interactions with internal and external customers.
   

Candidate should possess the following behavioral skills:

• Must demonstrate solid communication skills.
• Ability to work with multi-functional, multi-cultural teams.
• Demonstrated interpersonal skills including influencing, engaging, and motivating.
• Problem-solving technique with strong self-initiative and self-learning capabilities.

Qualifications:

Minimum Qualifications:

• Bachelor's Degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field.
• 9+ years of experience in advanced node semiconductor industry in BEOL Process Integration (preferably with experience in SADP/SAQP, advanced metallization, and/or immersion lithography/EUV).
• Candidate should also have experience with Device Physics and backend critical parameter control.
• Experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.

Preferred Qualifications:

• Advanced (Masters/PhD) degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field.
• Experience in project/program management and/or Task Force Team lead.
• Experience in leveraging big data analysis to identify process design weaknesses and/or manufacturing weaknesses in order to propose corrective, data-based solutions.
• Experience with extracting insights from structured and unstructured data by quickly synthesizing large volumes of data and applying statistics and machine learning.
• Experience in new semiconductor technology development.
• Experience in serving external Foundry customers through technical interactions.
• Experience in latest lithography and metallization device architectures.
• Experience in Statistics and machine learning preferred.

#foundry

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconducto