Sr. Principal Microelectronic Semiconductor Photolithography Process Engineer

RELOCATION ASSISTANCE: No relocation assistance available

CLEARANCE TYPE: Secret

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking an experienced and motivated Senior Principal Microelectronics Semiconductor Photolithography Process Engineer for our Advanced Packaging Technology µ-Line in Apopka, Florida. 

Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development.

The Apopka, Florida, wafer bumping µ-Line supports flip chip, 2.5D, and 3D packaging for internal and external production customers as well as emerging technology programs.  The line provides a range of bump compositions and processes that include photo, sputter, electro-plating, AOI, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers.  The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.

What you get to do:

The Senior Principal Microelectronic Semiconductor Photolithography Process Engineer will provide manufacturing and development technical support and direction on a wide range of photolithography processes and tools.

• Primary responsibility will include supporting photolithography processes and tools for resist coating, exposure, development, and associated metrology. The role will involve a broad range of lithography toolsets related to 1x manual and automated tools.
• You will work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, and drive continuous improvement initiatives.
• Plan and execute continuous photochemical and lithography improvement projects to increase yield, productivity, and cost effectiveness, including rework improvements.
• Define and implement lithography process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, etc.
• Develop new technologies across the portfolio of emerging technologies in semiconductor manufacturing, including photochemical, reticle, and lithography processes.
• Gather GDS files and program/foundry information to complete mask reviews with engineers and ensure layouts meet all design rules and guidelines
• Use GDS files and program/foundry information to create Apopka die drawing specific to each program for engineers, technicians, and operators to use to run the product.
• Mentor and train technicians on shift to support quality and delivery metrics for operations.
• Execute strategic projects for the improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out-of-spec material.
• Drive process improvements for volume manufacturing using statistical tools, DOE techniques, data-driven decision making, and systematic problem-solving skills.
• Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics.
• Lead Root Cause and Corrective Actions troubleshooting task forces and help develop solutions that prevent recurrence of excursion incidents using 8D problem-solving methodologies.
• Achieve customer on-time delivery and cycle time commitments through tool qualification and OEE management with manufacturing operations.
• Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for process changes.
• Position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.
• Support capital equipment projects through procurement, installation, and release for production use
• Support engineering data analysis, including metrology data, ERP (SAP) data, and other in-process metrics