Thermal Systems Lead Engineer - Electrical Loop

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Where is the work:

The Thermal Systems Lead Engineer for the Technical Loop will be a subject matter expert on data center system cooling solutions at the chip, server, and rack level. This role is critical for designing and developing next-generation thermal management systems to support high-density compute, including AI factories. You will be responsible for the "technical loop" of the thermal system, ensuring our solutions are innovative, scalable, and aligned with customer and partner technology roadmaps, such as NVIDIA's chip architectures.  The role requires deep expertise in thermodynamics, fluid dynamics, and data center cooling technologies to ensure Trane's solutions meet the market's evolving needs for extreme power densities.

WHAT YOU WILL DO:   

• Lead the development of multi-generational system roadmaps for the technical cooling loop, focusing on AI data centers of varying scales.
• Serve as an internal expert on advanced cooling technologies, including direct-to-chip, immersion, and 2-phase cooling and heat rejection system design.
• Collaborate with partners like NVIDIA to ensure thermal solutions meet future chip architecture requirements (e.g., DSX2 and beyond).
• Translate customer requirements into detailed technical specifications for equipment and controls teams.
• Own the technical loop thermal management system design within current and future reference design architecture. 
• Drive innovation by evaluating and integrating new cooling technologies and components into our system reference designs.
• Evaluate and select key components for the technical loop, such as pumps, valves, heat exchangers, and piping, with a focus on reliability, efficiency, and material compatibility.
• Provide coaching, mentorship, and technical guidance to junior engineers and cross-functional team members, fostering a culture of knowledge sharing.
• Represent the company in industry standards bodies like ASHRAE and the Open Compute Project (OCP) to influence future data center design.

WHAT YOU WILL BRING: (MINIMUM QUALIFICATIONS)

• Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum of 7-10 years of engineering experience, with relevant current focus on thermal system management on data center cooling.
• Extensive experience in thermal design for IT hardware, electronics, or data centers.
• Deep understanding of single-phase and two-phase cooling technologies.
• Thermal system experience working with high-power processors and accelerators (CPUs, GPUs).
• Strong ability to collaborate with cross-functional teams and external partners.
• The ability to thrive in a fast-paced and dynamic environment serving mission critical customers

KNOWLEDGE, SKILLS & ABILITIES REQUIRED: 

• Engineering background in data center/high-tech design is required. 
• Experience with PLC controls is a plus. 
• Experience with onsite power generation and/or backup power distribution is a plus. 
• Knowledge of HVAC products, components, and systems is desired. 
• Strong thermal/fluid energy and/or controls background is a plus. 
• Strong technical skills with a natural curiosity and enthusiasm to learn and develop new skills. 
• Technically creative yet grounded in real world feasibility. 
• Able to perform thorough and objective analysis. 
• Able to collaborate with and influence others 
• Self-motivated and disciplined. 
• Willing and able to transfer knowledge to other groups. 
• Good stand-up skills in front of customers and the field sales force. 
• Polished and