Sr. Hardware Engineering Manager

Hyve Company Overview 

Hyve Solutions transforms complex engineering challenges into production reality for technology innovators building AI, cloud, and connected infrastructure. As a US-based manufacturing partner, the company rapidly delivers fast, agile execution through dep technical partnerships and co-innovation, and supply chain clarity. Hyve’s integrated ODM, CM, and SI capabilities eliminate vendor complexity while accelerating time-to-market with single-partner accountability from design through scale. The company co-innovates with deep engineering expertise, treating customer success as its own while building tomorrow's digital infrastructure.  

Role Overview

Hyve Solutions is expanding its US-based design and engineering capability to support rapid growth in AI infrastructure for the world's largest Hyperscalers. The Senior Hardware Engineering Manager – AI Systems leads a multidisciplinary team of hardware engineers spanning board design, signal and power integrity, thermal, power delivery, and firmware, and is accountable for the day-to-day execution of next-generation GPU and compute server platforms from architecture through high-volume production. Where the Hardware Engineering Director sets organizational strategy across the US design organization, this role owns the engineering team and program delivery within it: building the bench, running the design reviews, and making sure platforms hit their EVT, DVT, and PVT commitments. It is a hands-on leadership position suited to an engineer who still enjoys reviewing a schematic or a channel simulation while managing the people who produce them.

Core Responsibilities

• Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.

• Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.

• Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.

• Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.

• Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.

• Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.

• Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.

Required Qualifications and Skills

• Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.

• Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.

• Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.

• Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.

• Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.

• Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.

Preferred Qualifications

• Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.

• Experience standing up a new engineering team or site, including recruiting and onboarding at scale.

• Familiarity with liquid-cooled AI system design and rack-level integration.

• Experience operating across US and Taiwan engineering teams

Compensation: $162K to $220K DOE

What’s in it for you