Senior Package Design Electrical Engineer

Perform design engineering in furtherance of optimized package design solutions for New Product and New Technology Introductions (NPI, NTI). Responsible for designing packages to meet product requirements for electrical performance, manufacturability, and cost. Run Electromagnetic (EM) modeling tools to improve package performance, and optimize the performance of package solution. Develop electrical design rules, package electrical data and models to improve the package layout including IO interface and power performance. Collaborate with multiple teams to provides package design solutions for Business Lines (BL) including Advanced Analog, Radio Frequency Processing, Edge Processing, Automotive Processing, and Connectivity & Security. 5% of international travel req’d.

Qualifications:

Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or related field.

One (1) year of experience in job offered, RF Delivery Engineer, Research Assistant, Microelectronics Packaging Design, EM Modeling or related occupations.

Required skills:

Position requires one (1) year of experience in the following special skills:

• EM modeling and simulation tools;
• Radio Frequency (RF) design;
• RF and multiple GHz wired & wireless modeling;
• Electrical design of various IO interfaces (e. g. LVDS, DDR, SerDes) used in semiconductor industry;
• RF measurement; and
• Manufacturing tolerance on RF performance.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.