Senior Mechanical Engineer: Laser Packaging Engineer

DRS Daylight Solutions business provides industry-changing photonic engine technology for government and commercial markets, including defense and security, quantum information sciences, life sciences, and industrial process control. As a laser technology pioneer, Daylight Solutions has delivered more mid-IR systems to more applications world-wide than any other company. Daylight laser solutions span the full spectrum from UV to visible to NIR to mid-IR.

 

At DRS Daylight Solutions, you will be eligible for competitive pay, great benefits, including Medical, Dental, Vision, 401k match, 9/80 work schedule, and Tuition Assistance. Our Daylight family-oriented culture allows you to receive hands-on training, professional development, career advancement and exposure to the latest and greatest technology, where our motto is "To protect with Light". Come join the family!

 

Job Summary

 

The Senior Laser Packaging Engineer at Daylight will be responsible for supporting the design and analysis of laser and photonic products. They should have a strong understanding of die bonding, vacuum reflow bonding, wire bonding, and adhesive bonding. They will support the design, analysis, documentation, and testing of photonic products, systems, and/or subsystems. Working with a multi-disciplinary design team, they will execute the mechanical modeling, prototyping, tolerance stack-ups, calculations, FEA, and testing. The successful candidate would be able to compile/review data and perform structural and thermal analyses (hand calculations, FEA) to make design decisions and implement them in CAD/documentation. Along with design, they will conduct formal reviews, support failure analyses and proposals. They should additionally be able to work independently, be flexible, and be receptive to ideas and feedback.

Job Responsibilities

 

• Develop novel laser packages for both free space and fiber coupled (single & multimode) outputs. Contribute to the design of the laser’s optical architecture.
• Design for hermetic optical and electrical feedthroughs and hermeticity testing
• Design, analyze, optimize and test adhesive bonds for structural and thermal use cases
• Design packages and lids compatible with laser welding and parallel seam sealing technologies 
• Develop electrical routing solutions utilizing wire/ribbon bonding and flex circuit architectures
• Design and optimize solder joints for die bonding and vacuum reflow bonding applications
• Develop thermal management and thermal control solutions for dense laser packages
• Uses computer aided engineering design software in the performance of assignments.
• Ability to work independently and regularly report progress and status
• Design, develop, analyze, document, and support testing of robust, precision opto-mechanical assemblies and laser packages
• Conduct detailed design reviews for both design and manufacturing audiences
• Perform thermal, structural, and vibration modeling of complex opto-mechanical assemblies
• Hands on prototyping, assembly, and test for characterization of design intent
• Facilitation of hardware procurement
• Writing engineering change orders and manufacturing work instructions
• Develop, purchase, fabricate and build prototypes to retire key development risks
• Support root cause analysis on failures
• Support and mentor junior engineers

The Ideal Candidate will have:

 

• Laser packaging experience
• Photonic integrated circuit packaging experience
• Ability to use engineering test and optical lab equipment
• Experience with optical modeling software; Zemax preferred
• Experience with CAD packages: SolidWorks and PDMWorks
• Experience with FEA packages: ANSYS structural and Icepak
• Experience with multimode, single mode and polarization maintaining fiber

 

Qualifications

 

• Bachelor’s degree in mechanical engineering, optical engineering, or related technical field with a minimum of 5 years of experience, preferably in opto-mechanics or precision mechanisms
• Fluency in technologies and application domain
• Ability to lead a technical group independently

 

The pay scale for this position is $104,274/year - $161,884/year. The pay scale information is a general guideline only.  Several factors can influence the pay scale for a position including but not limited to, Federal Government contract labor categories and contract wage rates, collective bargaining agreements