Senior Mechanical Engineer

Date Posted:

2024-08-30

Country:

United States of America

Location:

CA601: Goleta (EW) Bldg H01 6380 Hollister Avenue Building H01, Goleta, CA, 93117 USA

Position Role Type:

Onsite

Job Summary:

Raytheon is seeking a Principal Mechanical Engineer to lead new product development within the Electronic Warfare Mechanical Design Hardware Department.  The section specializes in the design, integration, verification, and production of digital processor and RF receiver subsystems for airborne platforms.  The candidate participates in the mechanical development supporting a variety of programs in Goleta, California.  Key interfaces will be with other sections across the Department, other Engineering disciplines, as well as internal customers leading the supporting programs.

The Senior Engineer is a key technical contributor to the programs and products supported by the department. These activities include designing RF systems for challenging thermal and high vibration environments.  This candidate will lead programs as a Responsible Engineering Authority (REA) or Integrated Product Team Lead (ITPL), and serves as a liaison to programs, ensuring program success as well as overseeing junior engineer’s job assignments and performance.

This role also requires the candidate to possess working knowledge of electronics packaging design.  This knowledge set may include, but is not limited to, thermal and structural design and analysis, electrical component design, construction and failure modes, printed wiring board and circuit card assembly processes and best practices, surface mount and through hole component installation processes and failure modes, metal fabrication and finishing methods, RF isolation mechanical design, and environmental test methods and equipment. Candidate may also have working knowledge of electronics/processor systems design and development utilizing COTS/MOTS components and products.

The candidate must have an outstanding ability to provide technical support and act as a mentor to his/her matrix team.  The candidate must be familiar with making technical presentations and at establishing customer relationships.  The candidate shall be a highly motivated “self-starter” able to lead by example, possessing strong interpersonal, written and verbal communication skills, and maintain positive relationships and satisfaction with functional and program leadership. 

We value diverse skills and experience, so don’t hold back. Your qualification could add tremendous value to our team. Our customers come from all different backgrounds, and so do our employees. If you’re passionate about what you could accomplish here, we’d love to hear from you.

Qualifications You Must Have:

Bachelors in science, Technology, Engineering, or Mathematics (STEM) .

5 years’ experience with Mechanical Design, Development and/or Implementation of Defense related Electronic Systems OR 3 years with an advance degree.

Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures.

Previous experience as a leader of a technical team including Integrated Product Team Lead (IPTL), Mechanical or Hardware Lead.

Broad based mechanical engineering experience spanning the product development lifecycle including detailed design, packaging, manufacturing support, hardware integration and testing.

Experience with solid modeling with a minimum of three years of creating and documenting mechanical designs in CREO or similar modeling tools.

Active and transferable U.S. government issued security clearance is required within 6 months of start date. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Qualifications We Value:

Experience with EW/Radar Systems or RF Products.

Experience with Conformal Antenna Array Packaging.

Experience with managing budget and schedule (Earned Value Management (EVM)).

Previous experience with design reviews including preparation of chart decks, generating design artifacts and presenting to customers.

Experience with electronics packaging, cabling and harness design, or printed wiring board designs and routing.

Experience with structural and thermal analysis using FEA modeling techniques.

Experience developing Basis of Estimate (BOEs) for proposals and providing proposal technical volume leadership.

Proficiency with Parts Management and Materials and Process Engineering.

COTS / MOTS Design and Development.

Experience executing root cause analysis and developing effective corrective a