RF Hardware Engineering Lead - Space RF Systems

We are seeking a RF Hardware Lead to drive the design, integration, and delivery of high-reliability RF/mixed-signal printed circuit assemblies for phased-array and advanced radar/communications products. You will own the PCB lifecycle—from stack-up definition and layout governance through fabrication, assembly, bring-up, and release—while leading functional team to meet performance, cost, schedule, and quality objectives for DoD programs and working closely in a cross-functional team.

On any given day, the selected candidate may be asked to perform the following:

• Define multilayer, hybrid dielectric RF stack- including impedance tables, via strategy (blind/buried, backdrill, VIPPO), copper weights, and plating/finish (ENIG/ENEPIG) to meet RF loss, isolation, and manufacturability targets.
• Partition boards for RF, mixed-signal, and high-speed digital with attention to shielding, grounding, return paths, and thermal management (coins, thermal vias, heat spreaders).
• Establish and enforce RF layout rules (transitions, launch geometries, via fences, cavity cutouts, keep-outs) and high-speed constraints (length/phase matching, crosstalk control, reference continuity).
• Lead/perform SI/PI/RF simulation and verification (e.g., ADS, HFSS, SIwave/Sigrity, CST) to predict insertion loss, VSWR/return loss, coupling, eye margins, and PDN impedance.
• Lead schematic capture, ECAD library governance (footprints/3D models), and DRC/DFM sign-off in Altium/Cadence/Mentor.
• Run formal design reviews, drive closure of action items, and maintain design histories, BOMs, and ECOs through PLM.
• Own fab and assembly drawing packages, stack-up notes, controlled impedance requirements, coupons, panelization, and testability features.
• Collaborate with PCB fabs/CMs on builds (Class 3), negotiate tolerances, and resolve issues (mask alignment, plating thickness, impedance yield, lamination strategy).
• Plan and execute board bring-up; define acceptance tests and interface with RF test for S-parameters, noise figure, PAE, ACPR/EVM, and linearity (P1dB/IP3/AM-AM/AM-PM).
• Drive root-cause and corrective action (RCCA) for yield/field issues; partner with Reliability/ESS for environmental compliance
• Provide technical leadership and mentorship to PCB layout engineers and RF/digital designers; develop design guides, checklists, and training.
• Coordinate with cross functional team and lead RF hardware system design
• Ensure documentation meets DoD/contractual requirements, configuration control, and ITAR/export compliance; maintain clean, version-controlled release artifacts.

Required Qualifications

• Bachelor’s degree in electrical engineering or related engineering field.
• Experience: 5+ years in RF/microwave and mixed-signal PCB development for high-reliability products; demonstrated ownership from concept through production.
• Technical Depth:
  • Proven expertise in RF board layout for L/S/C/X/Ku/Ka-band front-ends (LNAs, PAs, switches, beamformers, PLL/synth, couplers/splitters).
  • Hands-on with hybrid stack-ups, controlled impedance design, backdrill/HDI strategies, and thermal/shielding practices.
• Tools: Proficiency with one or more ECAD suites (Altium Designer, Cadence Allegro/OrCAD, Mentor/Xpedition) and analysis tools (Keysight ADS, Ansys HFSS/SIwave, CST).
• Standards/Quality: Working knowledge of IPC-2221/2223, IPC-6012, IPC-A-600/-610 Class 3, ANSI/ESD S20.20, and DoD documentation practices.
• Ability to obtain a DoD Top-Secret/SCI clearance.

Desired Qualifications

• Master’s degree preferred.
• Experience delivering phased-array TR modules, beamforming IC integrations, or wideband front-ends in production.
• Background in design for ruggedization and environmental screening (thermal cycling, vibe/shock) and reliability analysis (derating, FMEA).
• Familiarity with PLM (e.g., Arena/Windchill), manufacturing with domestic CMs, and rapid RCCA/MRB/CCB processes.
• Exposure to mmWave packaging, RF connectors/launches (SMPM/SMP/SEARAY/coax launches), and fixture design for S-parameter/over-the-air test.
• Certifications (IPC CID/CID+), or equivalent PCB design credentials.
• Excellent technical communication, supplier interaction, and concise documentation skills.
• Track record leading cross-functional design efforts, running reviews, and mentoring engineers.
• Active Secret or TS preferred.

Salary Range: $115,000 - $150,000
The BlueHalo pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Determination of official compensation or salary relies on several factors including, but not limited to, level of position, job responsibilities