Process Integration Engineer | APTD

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Opportunity Summary:

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

Have you ever dreamed of giving to the development of groundbreaking technologies?

We have a phenomenal opportunity for a motivated and confident individual to join our Advanced Packaging Technologies Team in Boise, Idaho.

As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, build program plans, and secure resources to drive process technology development programs.

Your development focus will also pertain to a yield improvement & process margin improvement roadmap to ensure extended engagement with manufacturing to ensure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set direction with the alignment of leaders and partners and demonstrate the ability to guide individuals toward project objectives.

You will be recognized as an authority in broader integration areas by peers in the manufacturing and technology development organizations. The ideal team member would be adept to accepting change and volatility and operate with a sense of urgency. Apply sound engineering principles and judgment, seek advice from e-authorities, and make critical and timely decisions. You will need to advise and lead the work of others and ensure good communication, engagement, and accountability leading to the achievement of the program goals.

(Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of best-in-class engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.

*This position will be a hybrid role located in our headquarters in Boise, ID.

*The seniority level offered will be based on a combination of experience and education.

What’s Encouraged Daily:

Line Monitoring

• Project Management

• Yield Improvement

• Develop new line monitoring methods & processes

• Statistical analysis

• Resolving critical metrics for line monitoring

• Use Micron systems for conducting experimental work and documenting outcomes

• Analysis of results from experiments and providing clear and practical recommendations or decisions

• Writing Engineering Change Notices and Change Documentation (ECN and GCP)

Leading problem-solving activities

• Perform Kempner-Tregoe (KT) or KT-like problem-solving & decision-making process

• Define Implement Design of Experiment (DoE)

• Communications - same site and site-to-site

• Present to others

• Coordinating conversion timelines

• Develop and innovate, establish contingency plans

• Drive process innovation for outstanding solutions and technology passionate about cost efficiency.

• Vertical integration capability to define highly sophisticated process flow

Coaching & Mentoring

• Coaching & mentoring early/mid-career engineers & technicians

• Teaching classes as needed

Growth Mindset

• Continue to build new skills through development goals & learning events

• Seek out opportunities to work multi-functionally, build a network, & gain competency across domains

How To Qualify:

• Bachelors, MS or PhD or equivalent experience in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or a closely related field

• Deep knowledge of Advanced Package Integration and DRAM, NAND or other memory. (3DIC, FO, Hybrid bond...etc.)

• Excellent data extraction, analysis, and reporting skills. (System analytics, JM, etc.)

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