Principal PCB Engineer – Datacenter / High-Speed Systems
qualcommAbout the role
Company:
Qualcomm Technologies, Inc.Job Area:
Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:
We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms.
This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap.
Key Responsibilities
1. PCB Design & Manufacturing Readiness
Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards
Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability
Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
2. Supplier Engagement & Capability Validation
Engage with PCB manufacturers (fabricators & assemblers) to:
Understand design rule capability (trace/space, via structures, stack-up complexity, materials)
Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies
Collect and analyze supplier data to validate manufacturing capability vs design requirements
Drive multi-source strategy and supplier qualification for high-volume production
3. NPI & Manufacturing Support
Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems)
Troubleshoot PCB fabrication / assembly issues:
Yield excursions
Reliability failures
Process limitations
Lead root cause analysis and implement corrective & preventive actions (CAPA)
4. Technology Roadmap Development
Drive PCB technology roadmap in collaboration with suppliers:
Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)
New materials (low-loss, high-Tg, ultra-thin core, glass core evolution)
High layer count / ultra-high density interconnect solutions
Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm’s platform capability
5. Industry & Competitive Intelligence
Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology)
Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.)
Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions
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