Jobs and Careers
QU

Principal PCB Engineer – Datacenter / High-Speed Systems

qualcomm
San Diego, United Statesfull_timeVerifiedPosted 30 Jun 2026
💰 $302,400/yr($201,600/yr$302,400/yr)

About the role


Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

 We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms
This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap. 

Key Responsibilities 

1. PCB Design & Manufacturing Readiness 

  • Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards 

  • Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability 

  • Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability 

 

2. Supplier Engagement & Capability Validation 

  • Engage with PCB manufacturers (fabricators & assemblers) to:  

  • Understand design rule capability (trace/space, via structures, stack-up complexity, materials) 

  • Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies 

  • Collect and analyze supplier data to validate manufacturing capability vs design requirements 

  • Drive multi-source strategy and supplier qualification for high-volume production 

 

3. NPI & Manufacturing Support 

  • Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems) 

  • Troubleshoot PCB fabrication / assembly issues 

  • Yield excursions 

  • Reliability failures 

  • Process limitations 

  • Lead root cause analysis and implement corrective & preventive actions (CAPA) 

 

4. Technology Roadmap Development 

  • Drive PCB technology roadmap in collaboration with suppliers:  

  • Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.) 

  • New materials (low-loss, high-Tg, ultra-thin core, glass core evolution) 

  • High layer count / ultra-high density interconnect solutions 

  • Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm’s platform capability 

 

5. Industry & Competitive Intelligence 

  • Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology) 

  • Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.) 

  • Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions 

Apply for this role

Generate a tailored application kit with a matched cover letter, interview prep, and CV highlights — in under 60 seconds.

Apply Now →Generate Application Kit

Free account required — sign up in 30s

Company

qualcomm

View company profile →