Principal Packaging Engineer

The Greensboro Thermal Lab is seeking a highly motivated Packaging Thermal Engineer to lead infrared-microscope-based thermal characterization of Qorvo's RF product portfolio (open-face and overmolded devices). This engineer will own test methodology from setup through data interpretation, applying RF device physics and thermal management principles to correlate results with electrical/RF performance and package design. A key part of the role is building automation to improve throughput, repeatability, and reporting across the lab, along with communicating findings to design, applications, and quality engineering teams. 

Description 

• Lead infrared microscope-based thermal characterization of RF power amplifiers, switches, and other packaged/overmolded devices 

• Set up and troubleshoot electrical/RF test conditions (bias, drive) using DC power supplies, RF signal generators, power meters/sensors, RF amplifiers, network analyzers, and arbitrary waveform generators 

• Develop test methodologies correlating thermal performance with RF operating conditions (Pin/Pout, efficiency, junction temperature) 

• Build and maintain automation scripts (Python, MATLAB, LabVIEW, or similar) to control instrumentation and streamline data acquisition, analysis, and reporting 

• Author engineering reports and present thermal findings/recommendations to design, applications, reliability, and quality engineering teams 

• Guide sample preparation, including board/fixture considerations and die milling/polishing for optical thermal access 

• Evaluate new thermal measurement equipment and techniques, and mentor technicians on test execution and data integrity 

Qualifications 

• Master's degree in Electrical Engineering, Physics, or related field 

• 8+ years of relevant experience or an equivalent amount of advanced education and experience  

• Solid understanding of RF device operation (power amplifiers, switches) and package-level thermal behavior (thermal resistance, heat spreading, die-attach effects) 

• Demonstrated coding/scripting ability (Python, MATLAB, or equivalent) for instrument automation and data analysis 

• Hands-on experience with RF/lab equipment: DC power supplies, signal generators, power meters/sensors, amplifiers, network analyzers, signal analyzers 

• Strong attention to detail, with clear written/verbal communication skills for cross-functional engineering collaboration