Principal Material and Process Engineer – Advanced Microelectronics Packaging
BoeingAbout the role
Company:
The Boeing CompanyJob ID:
00000430668Date Posted:
2024-06-24Location:
USA - El Segundo, CAJob Description Qualifications:
We are Boeing Research and Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists, and bold innovators. Join us and put your passion, determination, and skill to work building the future!
BR&T is looking to hire a Principal Material and Process Engineer – Advanced Microelectronics Packaging who will provide support to various space and defense programs, in El Segundo, California.
The Materials and Process Group in El Segundo develops, provides, and maintains technical competency and integrity in the definition, evaluation, analysis, management, selection and control of materials, processes, and parts. In this role, you will be responsible for the development, implementation, and continuous improvement of manufacturing equipment, tools, and processes.
The ideal candidate has a background with materials science and extensive experience with microelectronics process development and production engineering.
Position Responsibilities:
Assists with definition of requirements for tools, equipment, materials, parts and processes used in the engineering design, manufacture and/or maintenance of Boeing products
Drafts engineering specifications and other documents to manage the deployment of tools, equipment, materials, parts and processes
Assists with evaluation of emerging technologies for potential application to business needs
Assists with development and qualification of new tools, equipment, materials, parts and processes to meet requirements
Performs routine tests and audits to qualify suppliers to applicable requirements
Conducts routine analysis to determine performance or reasons for failures of tools, materials, parts or processes
Assists with implementing corrective and preventive actions
Develops computer and production systems to satisfy user requirements
Uses project management tools to meet cost, technical, and schedule requirements
Incorporates environmental health and safety, LEAN and Quality principles into (1) materials and processes, (2) research, design and qualification, (3) work procedures and (4) labs and office areas
Design and development of microelectronic packaging approaches for advanced electronics
Leads development of manufacturing and assembly for advanced heterogeneous integration
Establish and stand up new in-house production capabilities from process to equipment to facilities
Supports external partners for development and production of custom designs
Leads and mentors’ junior engineers and technical teams
Stay updated with the latest industry trends and technologies in advanced packaging
Documents and presents technical findings and developments to stakeholders and at industry conferences
This position is expected to be 100% onsite. The selected candidate will be required to work onsite at the listed location.
This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret/Sensitive Compartment Information (SCI) clearance Post-Start is required.
Basic Qualifications (Required Skills/Experience):
Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
10+ years of leadership within the microelectronic field
8+ years of experience with lab tools and general purpose lab equipment
8+ years of experience with implementing and monitoring statistical process controls
Preferred Qualifications (Desired Skills/Experience):
15+ years of experience of development, verification, and q
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