06 - Associate Engineer, Test Manufacturing

Req ID: 124957 
Remote Position: No
Region: Asia 
Country: Thailand 
State/Province: Chonburi 
City:  Laem Chabang 

Summary

The Lead Engineer, Test Manufacturing accepts, transfers, installs, improves and maintains automatic test equipment and test programs that are used for product testing and design verification. They also may support the test development of the test equipment and processes to ensure robust and high quality test solutions and final products are realized.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Failure Analyze and interpret data and information from yield reports and equipment logs and product diagnostics to determine sources of failure and yield loss.
• Debug and troubleshoot product failure using data analytic, DOE (design of experiments), TDR, Six Sigma tools, and failure analysis methodologies
• Collaborate with Customer, Design, Quality, Process, Supplier Engineer into problem solving and test yield and performance issues.
• Drive failures troubleshooting and develop debug methodology since NPI
• Set up continuous yield improvement and bone pile drive with customer and design team
• Introduce proper debug tools and capacity per projected failure rate.
• Analyze failure opportunity and develop and implement test, debug, component failure procedures for efficient and effective detection of defects.
• Analyze test results and provide feedback to design and component engineers for product performance improvement.
• Evaluate and integrate new test/debug technology to enhance capabilities and address evolving product requirements
• Collaborate with the team on bone pile, scrap and NDF reduction, productivity improvements to cycle time.
• Provide solution support to test engineers to improve detection, increase test coverage, and improve product performance.

Knowledge/Skills/Competencies

• Deep understanding of automatic test equipment (ATE) used in electronics industry, such as flying probe testers, in-circuit testers (ICT), and functional testers.
• Expertise in defining, specifying, qualifying, installing, supporting, and optimizing test processes and equipment for PCB assembly (PCBA).
• Proven ability to lead and drive test process optimization initiatives for PCBAs, focusing on reducing test cycle time and improving first-pass yield.
• Advanced proficiency in debugging test programs and fixtures for PCBAs using techniques like boundary scan, fault dictionary analysis, and circuit schematic interpretation.
• Thorough knowledge of PCB manufacturing processes and common defects (e.g., solder joint issues, component placement errors, shorts, opens).
• Strong understanding of electrical testing principles and methodologies relevant to PCBAs.
• Familiarity with IPC standards related to PCB assembly and testing.
• Knowledge of data analysis and statistical methods for interpreting test results and identifying trends in PCB assembly defects.
• Excellent collaborative and communication skills to work effectively with SMT, Process, and Quality Engineering teams.
• Strong project management skills to lead test equipment implementation and improvement projects.
• Ability to analyze and interpret data from yield reports, equipment logs, product diagnostics, and test results to identify failure sources and yield loss.
• Proven ability to debug and troubleshoot product failures effectively.
• Proficiency in using data analytics techniques to identify patterns and root causes of failures.
• Experience in designing and executing experiments to investigate and resolve issues.
• Knowledge and experience in using TDR for failure analysis.
• Familiarity with and application of Six Sigma methodologies and tools for process improvement and problem-solving.
• Strong understanding and application of various failure analysis techniques.
• Excellent interpersonal and communication skills to effectively collaborate with cross-functional teams and provide feedback.
• Ability to drive failure troubleshooting and develop debug methodologies from the New Product Introduction (NPI) phase.
• Understanding of continuous yield improvement principles and the ability to drive initiatives.
• Ability to identify, introduce, and implement appropriate debug tools and capacity.
• Skill in analyzing failure opportunities and developing and implementing efficient test, debug, and component failure proc