Offshore Assembly Engineer

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together. The Company’s three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles.

Snap Lab is home to our hardware products with a world-class research & development team. We are focused on pushing the boundaries of what a camera can be, specifically overlaying computing on the real world. Next Generation Spectacles are our first pair of glasses that bring augmented reality to life. 

We're looking for a Semiconductor Offshore Assembly Engineer to join our team!

What you’ll do:

• Technical management of OSAT partners and related subcontractors and suppliers

• Technical manufacturing lead for semiconductor and optical device assembly activities and technology development roadmap

• Oversee qualification of new assembly technologies, OSAT partners and suppliers or changes to existing packaged solutions to ensure quality and mitigate risk

• Reliability and yield enhancement of the utilized assembly technologies and packaged parts

• Project management of off-shore assembly houses

• Manage the product development procedure relating to assembly and packaging,  ensuring the transfer of process and products from the development phase to production release is completed successfully and on schedule.

• Lead packaging global cost reduction, standardization and new system implementation projects

• Interface with the product development teams in recommending and evaluating package solutions to meet performance and market requirements

Knowledge, Skills & Abilities:

• Knowledge and experience of New Product Introduction.

• Thorough working knowledge of electrical circuits, package signal integrity, and finite element analysis

• CAD experience (substrate/leadframe design, bond diagram, and package outline drawing)

• High volume manufacturing experience, including package failure analysis techniques

• Strong verbal, written, presentation, analytical and interpersonal skills.

• Strong analytical and problem solving ability. Appreciation of both practical and theoretical methodologies.

• Experienced in equipment selection, commissioning and process set-up.

• Knowledge of troubleshooting guides, OCAPs, working documentation, safety.

• Knowledge of quality systems and reliability assessment.

• Experience working with OSATs in Asia.

 Minimum Qualifications:

• Bachelor's Degree in Engineering, Materials or Physical Sciences.  

• 3+ years of experience in semiconductor assembly process engineering, packaging engineering, and quality & reliability

Preferred Qualifications and Experience:

• Liquid Crystal or related display experience.

• Display system experience including background in one or all related disciplines (optical, electrical, mechanical).

• Master's Degree in Engineering or Business preferred.

• Must be willing to travel on occasional, including internationally (typically < 1/month)

If you have a disability or special need that requires accommodation, please don’t be shy and provide us some information.