Senior Electronic Packaging Engineer

Senior Electronic Packaging Engineer

Company:

The Boeing Company

Job ID:

00000433740

Date Posted:

2024-08-02

Location:

USA - Tukwila, WA

Job Description Qualifications:

The Boeing Research & Technology is seeking a Senior Electronic Packaging Engineer to join the team at Tukwila, Washington.

At Boeing, we create the future — of mobility, autonomy, speed, endurance, space access and exploration, undersea vehicles, cybersecurity, communication and much, much more.  We connect people, products and ideas around the world.  We protect people and nations.  We explore the mysteries of the universe from seabed to space to cyberspace.  We inspire future generations of innovators, dreamers and doers.

We are Boeing Research & Technology: Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.  We are engineers and technicians, skilled scientists and bold innovators who are designing the next generation of communication systems for commercial transport airplanes, UAVs and SatCom.  Join us and put your passion, determination, and skill to work building the future!   #TheFutureIsBuiltHere  #ChangeTheWorld

The Communications and Sensing Technology team is seeking an experienced microelectronic packaging engineer to be part of a team to design electronic devices and boards for communication, sensor, electronic warfare and satellite systems.  This person will lead advanced electronic packaging analysis, develop architectural approaches and detail specifications as well as conduct packaging design reviews to ensure compliance to program requirements.  Also be responsible for resolving complex issues on critical programs related to advanced packaging approaches, requirements, specifications and design. 

Position responsibilities:

• Leads analysis of customer and system requirements and development of architectural approaches and detailed specifications for various electronic products
• Leads development of high-level and detailed designs consistent with requirements and specifications
• Leads reviews of testing and analysis activity to assure compliance to requirements
• Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements
• Leads activities in support of Supplier Management with make/buy recommendations and other technical services
• Coordinates engineering support throughout the lifecycle of the product
• Plans research projects to develop concepts for future product designs to meet projected requirements
• Works under minimal direction

This position is expected to be 100% onsite.  The selected candidate will be required to work onsite at the listed location.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):

• Bachelor's Degree or higher from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
• 5+ years of experience in the field of microelectronics packaging including MCM, heterogeneous integration, 3D chip stacking, etc
• Experience with complex packaging architectures on circuit performance including speed, thermal, etc
• Experience with SWaP-C constrained electronics development
• Experience with EDA tool flow and vendor supports including but are not limited to chiplets floor-planning, interposer design, SiP optimization, physical simulation, and chiplets assembly

Preferred Qualifications (Desired Skills/Experience):

• 10+ years of related work experience or an equivalent combination of education and experience
• Experience with design, development and testing of advanced packaging techniques. This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (MCMs) and System-in-Package (SiP) for digital and RF products
• Experience with 3DIC development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical