Metals/Films Process Development Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron Technology, Inc., as an Engineer-CVD Metals/R&D, you'll play a key role within the Metals Technology team, focusing on the development of thin films that meet the electrical requirements of rapidly evolving DRAM devices. Your responsibilities will include improving material properties to reduce line resistivity at smaller scales and optimizing permittivity and dielectric leakage. You’ll take ownership of process development, statistical process control, and hardware advancement to ensure readiness for manufacturing, working closely with integration and device teams. 

Within Micron’s Technology Development (TD) organization, you’ll work in a state-of-the-art semiconductor facility, developing next-generation memory technology. As a member of the thin film team, you’ll help advance materials and processes for future interconnects, transistors, and memory cells. Your collaboration will extend across internal groups such as equipment, integration, device physics, and pilot manufacturing, as well as with external suppliers of equipment and chemicals to design tools for advanced memory production. The position encourages independent work and participation in diverse teams to create innovative solutions. 

Responsibilities include: 

• Develop and characterize thin film solutions for advanced memory. 

• Identify interactions between process, chemistry, and hardware. 

• Plan and execute effective experiments and write clear detailed reports. 

• Make insightful inferences from large amounts of various types of data (data science, Python programming, and Generative AI experience is a plus!) 

• Always ready to learn new things and adapt in an ever changing industry! 

Preferred Qualifications: 

• Proven communication and teamwork experience. 

• Sound fundamentals of materials science and engineering; including thermodynamics, film growth kinetics, and alloy phase diagrams. 

• Basic knowledge of CMOS device physics. 

• Background in a variety of thin film deposition techniques, particularly ALD, CVD, and/or PVD. 

• Experience with several surface analysis techniques, such as: XPS, AFM, XRD, AES, EBSD, and/or SIMS etc. 

• Bonus: insight to use of CVD films in logic device technology. 

Education/Experience: 

• M.S. or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, Chemistry or related field. 

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