Senior Thermal Mechanical Engineer

Quantum computing holds the promise of humanity’s mastery over the natural world, but only if we can build a real quantum computer. PsiQuantum is on a mission to build the first real, useful quantum computers, capable of delivering the world-changing applications that the technology has long promised.  We know that means we will need to build a system with roughly 1 million qubits that supports fault tolerant error correction within a scalable architecture, and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more.

PsiQuantum has determined the fastest path to delivering a useful quantum computer, years earlier than the rest of the industry. Our architecture is based on silicon photonics which gives us the ability to produce our components at Tier-1 semiconductor fabs such as GlobalFoundries where we leverage high-volume semiconductor manufacturing processes, the same processes that are already producing billions of chips for telecom and consumer electronics applications. We also benefit from the quantum mechanics reality that photons don’t feel heat or electromagnetic interference, allowing us to take advantage of existing cryogenic cooling systems and industry standard fiber connectivity.

In 2024, PsiQuantum announced two government-funded projects to support the build-out of our first Quantum Data Centers and utility-scale quantum computers in Brisbane, Australia and Chicago, Illinois. Both projects are backed by nations that understand quantum computing’s potential impact and the need to scale this technology to unlock that potential. And we won’t just be building the hardware, but also the fault tolerant quantum applications that will provide industry-transforming results.

Quantum computing is not just an evolution of the decades-old advancement in compute power. It provides the key to mastering our future, not merely discovering it. The potential is enormous, and we have the plan to make it real. Come join us.

There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey!

Job Summary:

The cryogenic engineering department is hiring a mechanical design engineer who will be heavily involved in the thermal mechanical simulation and design for the quantum computer. This position will interact with multiple teams internally and suppliers externally.

Responsibilities:

• The Thermal Mechanical Engineer focuses primarily on the highly integrated electronic optical assembly to support quantum computer.
• Applying knowledge of heat transfer, fluid mechanics, and structural mechanics to the development of optical electronics assembly under cryogenic condition.
• Develop methodologies for chip power modeling and measurement, characterization of power features, correlate chip behavior with simulations and provide design feedback.
• Analyzing field issues related to electronic optical assembly design and providing solutions where required.
• General design activities such as requirements management, materials and component selection, Design Failure Modes and Effects Analysis (FMEA), and tolerance analyses.
• Assisting and/or directing vendors to develop necessary manufacture process.
• Actively participating in cross functional project teams through all phases of product development to ensure successful execution of innovative and best-in-class designs.

Experience/Qualifications:

• B.Sc., M.Sc., or Ph.D in Mechanical Engineering, Aerospace Engineering, Nuclear Engineering, or Physics.
• Software tools – Mathcad, Matlab, IcePak, ANSYS Workbench, Fluent, SpaceClaim, Solidworks, NX.
• Demonstrated use of advanced analysis tools to solve thermal/fluid challenges with respect to optical and electronic assembly at the appropriate level of detail – Finite Element Analysis (FEA) and Fluid Dynamics (CFD).
• Solid understanding of and experience matching thermal models to experiment results.
• Thoroughly documenting design inputs and outputs.
• Ability to adapt changes and handle multiple assignments.
• Excellent written and verbal communication skills.

Desired Skills/Experience:

• Experience with multiple material performance, design constraints, and manufacture constraints under cryogenics condition.
• Knowledge of common optical system specifications and optical component specifications.
• Experience in feeding thermal model resu