Sr Manager, Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. 

Position Overview:

We are looking for a Senior Manager for our Advanced Packaging Technology Development team. This position is responsible for the overall management and direction of Advanced Packaging process, equipment and materials definition, development and/or optimization. Steering, leading and optimizing departmental performance to meet or beat defined metrics.

Responsibilities:

Apply extensive knowledge to carry out strategies and collaborate with internal and external partners to build technology strategies aligned to corporate strategic objectives. You will provide advice to senior and executive management related to strategic decision for the function.  You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

• Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

  • Establish organizational roadmaps and strategies.  Apply extensive knowledge and tenacity to carry out strategies.

  • Develop and supervise department performance to plan. 

  • Collaborate with peers to construct global solutions.

  • Ensure conflict resolution and assist with identifying critical issue paths.

  • Communicate the corporate business environment and initiatives and provide direction.

  • Establish and communicate department capabilities to ensure partner expectations are aligned.

• Develop, qualify & continually improve Advance Packaging process/equipment/materials

  • Development and optimization of semiconductor packaging processes specific to Advance Packaging and collaborating with engineers in CMP, WET, ETCH, PHOTO, CVD, Bonding, debonding, Wafer prep, Hybrid bonding, TCB & pre/post encap departments to ensure high yield and quality standards are met.

  • Work with multi-functional team for a successful process/equipment/material development, CIP, and on other key strategic projects & programs implementation.

  • Own the selection, installation, and maintenance of equipment vital for Advance Packaging.  Collaborate with vendors and internal teams.

  • Identify risks and mitigation plans with partners & alignment with multi-functional teams.

  • Identify, diagnose and resolve issues during NPI phase by applying problem solving skills

Minimum Qualifications:

• Bachelor's or Master's in Electrical Engineering, Materials Science, Chemical Engineering, or related field.

• 10+ years of experience in Semiconductor Manufacturing on leadership capacity, with proven record of technical leadership

• Expertise in Front End, PWF, HBM technology, process development, and/or equipment management.

• Strong leadership and vision and able to comfortably work across organizational boundaries and geographies.

• Influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.

• Optimally collabor