BGA WB Process Engineer

• Lead improvement at the Wire Bond Process and manage all process control system to maximize quality outputs.

• Champion the Statistical Process Control reporting for the BGA WB department.

• Drive WB LOH to align to NXP Goal and meet customer on time delivery.

• Drive all quality excursions at the Wire Bonding process

• Drive yield improvement activities for all the BGA WB

• Work closely with the NPI team

Job Qualification

• Bachelor's degree in Engineering related and 1 -2 years wire bonding experience would be an added advantage.

• Knowledge in Statistical analysis tool experience (eg: JMP)

• High ownership and accountability to ensure targets are achieved in a timely manner.

• Excellent interpersonal communications skills and ability to work well in a team environment to develop positive relationships.

• Takes initiative, action-oriented and constantly raises the bar to drive excellent results.

• Possess quality mindset and engineering curiosity to deep dive for continuous improvement.

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