Advanced Packaging Pathfinding & Development – Thermal Engineer, (Principal / Senior Principal)

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

The Marvell Advanced Packaging Pathfinding and Development team is responsible for innovations in advanced packaging to create bleeding edge technologies for product intercepts in 3–5 years. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling, die to die interfaces, and complex power delivery networks that require innovative and custom solutions to meet constantly evolving customer needs for the creation of next generation AI training and inference modules. The team is responsible for driving solutions that are not available off-the-shelf. This includes new design and architectural concepts by partnering with vendors to create industry leading packaging solutions.

What You Can Expect

We are seeking a Principal or Senior Principal Thermal Engineer to lead thermal pathfinding and development for advanced packaging technologies targeting datacenter applications. The successful candidate will define thermal architectures, influence Marvell and industry roadmaps, and deliver validated solutions spanning silicon package to system and rack level integration.

Key Responsibilities:

• Architect and develop thermal solutions for advanced silicon packages targeting datacenter environments, from concept through validation.

• Hands on characterization of thermal test vehicles and cooling solutions.

• Define and execute thermal design, materials, and process development at component and system levels.

• Partner with external ecosystem stakeholders (vendors, substrate suppliers, OSATs, foundries) to define and align thermal technology roadmaps.

• Explore and assess next‑generation cooling technologies beyond current industry offerings; make recommendations and generate protected IP.

• Drive technology feasibility studies and deliver proof‑of‑concept demonstrations.

• Collaborate cross‑functionally with IP, silicon design, package design, manufacturing, reliability, and test teams.

What We're Looking For

• Demonstrated experience in advanced packaging technologies with deep expertise in heat transfer, fluid dynamics, materials science, package assembly and reliability.

• Proven experience delivering thermal solutions at both component and system levels. Experience in advanced thermal solutions such as on-package and in-package liquid cooling and immersion cooling is desirable.

• Experience managing and influencing vendors, substrate manufacturers, OSATs, and foundries.

• Education & Experience:

  • Bachelor’s degree with 15+ years relevant experience, or Master’s degree with 12+ years relevant experience, or PhD (or post‑doc) with 8+ years relevant experience
    (Mechanical/Thermal Engineering, Electrical Engineering, Materials Science, or related field)

Core Technical Skills

• Thermal Modeling & CAD Tools: Icepak, Flotherm, Celsius; SolidWorks, Creo

• Fundamental Expertise: Heat transfer, fluid dynamics, materials science, process

• Cooling Technologies:

  • Active and passive cooling solutions

  • Integration at component, system, and rack levels

• System‑Level Thermal Integration:

  • Package ↔ heat sink ↔ board ↔ server chassis ↔ rack

  • Thermal management for scale‑up and scale‑out architectures

• Advanced Packaging Experience:

  • 2.5D / 3D technologies including: CoWoS‑S / R / L; EMIB; CPO; CPC

• Thermal Characterization & Validation:

  • Thermal test vehicles (TVs)

  • DAQ systems, calibration curves, LabVIEW

  • Thermocouples, airflow characterization, thermal chambers

• Reliability & Failure Analysis:

  • Chip‑package interactions

  • Component‑ and board‑level failure mechanisms

Leadership & Collaboration Skills

• Ability to lead cross‑functional, multi‑site programs across global time zones.