Sr. Principal Ultra Mechanical IPT Lead

Date Posted:

2025-09-23

Country:

United States of America

Location:

AZ807: RMS AP Bldg 807 1151 East Hermans Road Building 807, Tucson, AZ, 85756 USA

Position Role Type:

Onsite

U.S. Citizen, U.S. Person, or Immigration Status Requirements:

Active and transferable U.S. government issued security clearance is required prior to start date.​ U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance​

Security Clearance:

DoD Clearance: Secret

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. 

The Mechanical Engineering group in the Shipboard Effectors Department is currently searching for an experienced Integrated Product Team Lead (IPTL) that is a Senior Principal Mechanical Electronics Packaging Engineer to work on a multi technical team to support design and upgrades of Shipboard Effectors products and subsystems located in Tucson, AZ.

This is an onsite role and requires strong communication skills to collaborate across Engineering, Operations, Supply Chain, and Quality. Tasks include supporting development or production, leading proposal activities, and technical management of mechanical engineering disciplines throughout the product life cycle.  Other tasks for the IPTL will be cost, schedule and technical management of their team.

   

What You Will Do

• Serve as the mechanical technical authority, providing expertise and oversight for all mechanical, environmental, structural, and thermal aspects of Ultra Block 1 and Block 2 stack configurations. 
• Lead a small team of mechanical production REAs supporting mechanical production and development efforts, ensuring technical excellence and alignment with program objectives. 
• Oversee and manage all mechanical, slice and stack TDP configuration changes, ensuring updates address producibility improvements, yield optimization, and design enhancements. 
• Lead efforts to analyze and incorporate producibility updates into designs to improve manufacturing efficiency and reduce production defects. 
• Support failure investigations, conducting root cause analyses and implementing corrective actions to resolve systemic mechanical issues. 
• Provide technical guidance on mechanical design, analysis, and integration challenges, ensuring compliance with program requirements and performance specifications. 
• Drive design for manufacturability (DFM) practices and lead efforts to identify and implement cost-saving opportunities in mechanical assemblies. 
• Collaborate with several teams, including systems engineering, Operations, Quality, and Supply chain, to resolve mechanical engineering challenges and ensure seamless integration of stack configurations. 
• Provide oversight and review of hardware performance during environmental testing, including structural and thermal analysis, to ensure compliance with design requirements. 
• Maintain and update mechanical TDPs, processing engineering change requests such as IRs, CNs, SRs, and variances to ensure accurate and current documentation. 
• Act as a mentor and technical resource for team members, fostering growth in mechanical engineering capabilities and ensuring adherence to best practices. 
• Experience with and use of mechanical CAD (Creo) software
• Experience with Electronic CAD process for developing PCB and CCA data packages
• Experience in developing rework processes for interim solutions to FITs for operators to rework into built hardware
• Experience in program or engineering project proposal writing
• Understanding of Geometric Dimensioning and Tolerancing (GD&T), basic tolerance analyses, and drawing practices and interpretation for mechanical hardware
• Experience with CREO (or equivalent CAD tool)
• Experience developing and executing a plan to develop a mechanical component or subsystem

Qualifications You Must Have:

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience unless prohibited by local laws/regulations.
• Ten (10) years of engineering experience, which must include working with Electronics Packaging
• Experience with RF systems &/or Microelectronics Packaging

Qualifications We Prefer

• Reliability test development and process qualif