Senior Foundry Process Integration Engineer & Project Manager - Superconducting Circuit

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We are at the forefront of the quantum race, competing with tech giants such as Google or IBM, and we are growing fast after securing  €100 million of funding in 2025 to develop our unique technology. Currently 100+ and counting, between physicists, PhD students, engineers and experienced business professionals, we are united to reach our ambitious goal. Are you a quantum pioneer? Join us on a mission to reshape the future!
We are building our own prototyping cleanroom in Île-de-France (operation planned for early 2026), designed to accelerate design iterations, reduce fabrication lead times, and strengthen our nanofabrication capabilities for high-performance and 3D integration.
Within the Quantum Hardware department, the Foundries & Process Integration (FPI) team plays a key role by bridging front-end and back-end nanofabrication with design and device performance. Its mission includes process data analysis, device modeling, transversal failure analysis, and managing foundry collaborations to ensure scalability.
We are seeking a Senior Foundry Process Integration Engineer – Superconducting Circuits to drive the development, qualification, and management of superconducting circuit fabrication with external foundry partners in France and worldwide. This role will also extend to 3D integration technologies (flip-chip, TSV, hybrid bonding) to ensure scalable and reliable qubit integration.The role will bridge design, nanofabrication, process integration, and external suppliers, ensuring high-quality deliverables aligned with our technology roadmap.

Responsibilities:

• Foundry Projects Management – Superconducting Circuits:
• Identify, qualify, and manage foundry collaboration projects in France and worldwide for superconducting circuit fabrication, which encompasses :
• Establishing clear design specifications and process requirements.
• Designing and coordinating the fabrication of test coupons to evaluate and benchmark foundry capabilities.
• Reviewing and validating process integration flows to ensure compatibility with device performance targets.
• Setting and enforcing quality control and acceptance criteria for wafers and devices delivered by foundry partners.
• Define and maintain design rules (DRM) and design-for-manufacturability (DFM) guidelines in close collaboration with design and nanofabrication teams.


• 3D Integration:
• Identify and evaluate 3D integration service suppliers (e.g., flip-chip bonding, through-silicon via (TSV), hybrid bonding).
• Participate in the qualification of 3D integration equipment and processes, in close collaboration with the front-end nanofabrication team.
• Ensure seamless integration of superconducting circuits with 3D packaging approaches to improve performance, scalability, and reliability.


• Cross-Team Collaboration
• Work closely with the Design and Implementation team to translate design requirements into foundry-compatible test structures.
• Collaborate with front-end and back-end nanofabrication teams and other members of FPI team to ensure design-to-fab alignment and robust process integration.
• Support root cause analysis of fabrication issues and drive corrective actions with suppliers and internal stakeholders.

Requirements:

• MSc/PhD in Electrical Engineering, Applied Physics, Materials Science, or related field.
• 5+ years of experience in semiconductor/superconducting fabrication, foundry management, or process integration.
• Familiarity with superconducting circuits, cryogenic devices, or advanced packaging.
• Proven expertise in 3D integration technologies (flip-chip, TSV, bonding) preferred.
• Strong knowledge of design rules, DFM/DRC, and test structure implementation.
• Proven track record in supplier management, including specification, quality control, and acceptance.
• Excellent communication and project management skills, with ability to work across multidisciplinary teams.

Benefits:

• Our success is your success : own it with our BSPCE plan
• Turn your ideas into patents – and (competitive) patent bonuses
• Flexible remote policy, up to 40 % a month
• A Parental plan including additional benefits such as crèche support or additional days-off to take