Senior Engineering Manager- Microelectronics Assembly
MedtronicAbout the role
At Medtronic you can begin a life-long career of exploration and innovation, while helping champion healthcare access and equity for all. You’ll lead with purpose, breaking down barriers to innovation in a more connected, compassionate world.
A Day in the Life
Location: Tempe, AZOnsite: 100%
Lead Manufacturing Engineering for Printed Circuit Board Assembly, Wafer Dicing, and Die Pick and Place Operations. Strong focus on yield improvement, process capability, day to day sustaining of a 24/7 operation to ensure Safety, Quality, Delivery, and Cost objectives are consistently met.
Senior Engineering Manager – Microelectronics Assembly
At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. We’re working onsite 5 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary.
This role will lead the Operations Manufacturing Engineering team for the Tempe Campus manufacturing location. The manager will lead a team of engineers in day-to-day line support to ensure the on-time manufacturing of high reliability microelectronic circuits for implantable medical devices.
Responsibilities Include (other duties may be assigned)
Daily Operations Oversight: Oversee 24/7 manufacturing/engineering operations within the packaging and test areas, ensuring alignment with production build plans and schedules.
Sustaining Engineering Leadership: Lead a team of sustaining engineers in resolving product and process issues, performing root cause analyses, and implementing long-term fixes and enhancements for released products.
Yield and Cost Improvement: Drive continuous improvement initiatives (e.g., Lean, Six Sigma, Kaizen) to enhance product yield, reduce manufacturing costs, and minimize scrap and rework.
Quality and Compliance: Establish and enforce procedures and processes that meet industry standards (ISO 13245), manage quality control, and ensure all documentation (BOMs, specifications, test plans) is accurate and compliant.
Cross-Functional Collaboration: Partner with R&D, Design Engineering, Manufacturing, Quality, and Supply Chain teams to support new product introductions (NPI), manage change orders, and address component obsolescence issues.
Team Management and Development: Provide leadership, mentorship, and technical guidance to a diverse team of engineers and technicians, setting goals, coordinating workloads, and fostering a culture of accountability and innovation.
Data Analysis and Reporting: Utilize advanced data collection and statistical methods (e.g., SPC) to monitor process capabilities, track product health trends, and provide regular status reports to executive management.
Must Have: Minimum Requirements
Bachelor’s degree in Engineering (Electrical, Mechanical, Industrial, or Semiconductor Packing) or related technical field
A minimum of 7 years of relevant experience with 5+ years of managerial experience, or advanced degree with a minimum of 5 years of relevant experience with 5+ years of managerial experience.
Nice to Haves:
Medical Device Experience in ISO 13485
Lean or DRM Green Belt or higher
10+ years in semiconductor process/manufacturing, with 5+ years in leadership/management, especially in assembly/packaging
Strong leadership, problem-solving, communication, project management, process integration, yield improvement, SPC, and deep knowledge of unit processes (SMT Assembly, Chip and Wire Bonding, Molding)
Physical Job Requirements
The above statements are intended to describe the general nature and level of work being performed by employees assigned to this position, but they are not an exhaustive list of all the required responsibilities and skills of this position.
The physical demands described within the Responsibilities section of this job description are representative of those that must be met by a
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