Sr. Repair Tech

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Sr. Repair Tech (Miniwave or BGA) to conduct any kind of PTH component reworks for PCAs repair.  You will be responsible for a wide variety of tasks within the Repair Department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing Center. 
The Sr. Repair Tech will work closely with Failure Analysis Engineer (FAE) and Debug technicians for PCAs BGA repair and assist this Department as needed.
Job Responsibilities:

• Hands on soldering skills for any type of component replacement. 
• The��Sr. Miniwave Rework Technician will perform hands-on PTH connector rework jobs for Through-hole type components on soldering repair for defective circuit boards.  

• The Sr. BGA Rework Technician will perform hands-on BGA rework jobs for BGA type ICs & larger SMD connectors on soldering repair for defective circuit boards.  Solid skill for manual solder printing & scavenger.