Senior Mechanical Packaging Engineer

Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

 

Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.

 

 

Equal Employment Opportunity

Draper is committed to creating a diverse environment and is proud to be an affirmative action and equal opportunity employer.   We understand the value of diversity and its impact on a high-performance culture.  All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, gender identity, national origin, veteran status, or genetic information.   

 

Draper is committed to providing access, equal opportunity and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact hr@draper.com.

Responsibilities

Responsibilities:

 

Draper is seeking senior mechanical design engineers for roles focused on electronics packaging for high-reliability and extended mission life systems.  The Electronics Packaging Engineer works closely with structural, thermal, electrical, system and manufacturing disciplines to meet design and operational requirements.  Specific responsibilities include:

 

• Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, test, and documentation support.
• Develop solutions for executing the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles.
• Develop die and module level packaging solutions including proposing solutions for placement and control of critical components requiring precise alignment to be maintained through shock, vibration, and thermal disturbances.

• Communicate effectively and openly with a multi-disciplinary program team members and program leadership, senior management, and sponsors.
• Define an approach to independently solve technical problems and execute assignments under the oversight of program leadership.

• Produce the production of fully released Technical Data Packages
• Lead technical teams of 3 or more people to accomplish program goals; developing schedule/budgetary estimates and mentor junior engineers.

• Identify technical and schedule risks associated with a design decision and communicate them to project leadership and customers or stakeholders.
• Strong organization, planning and time management skills to achieve program goals.

Qualifications

Qualifications:

 

Required Qualifications:

• Bachelor of Science degree with 7+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
• <OR> Master of Science degree with 5+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
• Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
• Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly
• Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
• Experience with 3D CAD, specifically CREO and/or Solidworks
• Experience with design considerations for manufacturability, proper drawing creation, and GD&T principles
• Experience with fabrication and assembly of prototypes and proof-of-concept models