About Eridu

Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate training and inference for large-scale AI models. Today’s AI performance is frequently limited by system-level bottlenecks. Eridu AI delivers multiple industry-first innovations across semiconductors, software, and systems to unlock greater GPU utilization, reduce capital and power costs, and maximize data center efficiency. The company’s solutions and value proposition have been validated by several leading hyperscalers.

The company is led by a veteran team of Silicon Valley executives and engineers with decades of experience in state-of-the-art semiconductors, optics, software, and systems, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (World’s leading micro-LED company and developer of the first augmented reality contact lens).

Position Overview

Eridu AI is seeking a highly technical Mechanical Engineer with deep expertise in multiphysics modeling, thermo-mechanical behavior, and advanced packaging architecture.

This is not a conventional mechanical design position. You will serve as the physics authority responsible for developing predictive first-principles models, conducting nonlinear multiphysics simulations, and experimentally validating complex thermo-mechanical systems across their full life cycle.

You will lead the mechanical design for advanced semiconductor and system-level packaging operating at extreme power density and structural constraints. This includes sustained compression environments, thermal expansion mismatch, contact mechanics, and long-term material behavior under load.

This role requires intellectual rigor, experimental ownership, and the ability to translate physics into robust, manufacturable hardware.

Key Responsibilities

Multiphysics Modeling & Mechanical Architecture

·       Develop first-principles analytical models (hand calculations and reduced-order models) to predict thermo-mechanical behavior of complex mechanical stacks.

·       Own nonlinear FEA simulations involving contact mechanics, plasticity, creep, stress relaxation, and thermal-mechanical coupling.

·       Analyze and optimize mechanical stack-ups under sustained compression and thermal cycling.

·       Evaluate material behavior under long-term stress, including fatigue, creep, and reliability degradation.

·       Define mechanical architecture trade-offs balancing structural integrity, thermal performance, and manufacturability.

·       Drive predictive modeling to anticipate failure modes before physical hardware validation.

Experimental Design & Validation

·       Design and execute thermo-mechanical experiments to validate analytical and simulation models.

·       Develop instrumentation strategies (strain gauges, thermocouples, displacement sensors, load cells, displacement measurement systems, etc.) for high-fidelity measurements.

·       Characterize material behavior under compression, thermal cycling, creep, and fatigue conditions.

·       Correlate experimental data with nonlinear FEA simulations and calibrate models for predictive accuracy.

·       Define accelerated life testing methodologies to assess long-term mechanical and thermo-mechanical reliability.

·       Establish validation frameworks spanning prototype through high-volume production.

·       Drive data-based decision making across the entire product life cycle.

Advanced Packaging & System Integration

·       Lead thermo-mechanical design of advanced semiconductor packaging (2.5D, 3D, SMT, substrate-level integration).

·       Investigate and develop novel packaging approaches and mechanical compression architectures.

·       Evaluate CTE mismatch, interfacial stress distributions, and structural stability in high-density electronic assemblies.

·       Collaborate with sili