Hewlett Packard Labs - Research Engineer: ReRAM/CMOS integration and materials processing

Hewlett Packard Labs - Research Engineer: ReRAM/CMOS integration and materials processing

  

This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know diverse backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description:

   

Hewlett Packard Labs is an international research organization with its headquarters and largest facility located in Milpitas, California. As the central research organization for Hewlett Packard Enterprise (HPE), Hewlett Packard Labs' purpose is to deliver breakthrough technologies and technology advancements that provide a competitive advantage for the company, by investing in fundamental science and technology in areas of interest to HPE and getting the resulting technologies ready for adoption into new and existing markets.

We expect all our researchers to provide thought leadership and technical influence both internally and externally to HPE, as well as take innovative ideas and make them real – contributing along the full range from initial novel ideas to design, development, implementation, evaluation, and technology transfer. The ideal candidate can thrive in an applied research environment, balancing significant technical and scientific contributions with the ability to bring such contributions to practice through innovative solutions that address the needs of our customers and partners. We expect the successful candidate to collaborate with Hewlett Packard Labs research teams as well as with external partners, and to work in alignment with HPE's broader innovation community.

Role and Responsibilities

The Emerging Accelerators Team in the AI Research Lab at Hewlett Packard Labs has an opening for a Research Engineer with a background in material science research and engineering, processing, nanofabrication, electron devices, or related fields. The researcher will drive the CMOS/memristor (RRAM) BEOL integration and process development, combining CMOS and emerging RRAM device technologies on prototype silicon chips for in-memory computing applications including machine learning, neuromorphic computing, optimization, and other computational models.

The candidate will work in a team environment to develop the CMOS memristor BEOL and packaging process steps for hybrid CMOS/RRAM systems.  The work will span a range of activities including: RRAM process development for hybrid CMOS integration, packaging process development and integration, engagement with external vendors, RRAM device testing and materials tuning, operation of existing hardware platforms, device modeling.

Qualifications and Education Requirements

• PhD graduate in Materials Science Engineering, Applied Physics, Computer Engineering or related area.

• Experience working in a research cleanroom with common cleanroom tools and chemicals.

Preferred Skills

• Highly self-motivated, strong problem solving and critical thinking, skillful with instrumentation and hand-on measurements in lab of materials and devices.

• Able to work independently and collaborate in cross-functional teams.  

• Familiarity with: emerging memories (such as RRAM or ReRAM, PCM, MRAM, FeFET, etc..), thin film characterization, electrical characterization, metrology, semiconductor processing, metal oxide materials, modeling of emerging memories for in-memory computing.

• Tools experience with: sputter, e-beam evaporation, dry and wet etch, photo lithography, e-beam lithography, AFM, SEM.

Additional Skills:

Accountability, Accountability, Action Planning, Active Learning (Inactive), Active Listening, Agile Methodology, Agile Scrum Development, Analytical Thinking, Bias, Coaching, Creativity, Critical Thinking, Cross-Functional Teamwork, Data Analysis Management, Data Collection Management (Inactive), Data Controls, Design, Design Thinking, Empathy, Follow-Through, Group Problem Solving, Growth Mindset, Intellectual Curiosity (Inactive), Long Term Planning, Managing Ambiguity {+ 5 more}