Senior Manager, PCB Design

At pSemi Corporation, we encourage individual development with internal career opportunities. We thrive to build a versatile and valuable workforce capable of handling our biggest challenges while retaining our biggest assets, our employees. To be eligible to apply for an internal position you must be a regular full-time or part-time employee, must be in your current role for at least 12 consecutive months, must have a performance review rating of meets expectations (3) or greater, and must not have had a written performance or disciplinary issues within 6 months of applying for a new role. Prior to submitting your application, please discuss your interest with your current supervisor as you will want your current supervisor to be aware of your intent before the hiring manager comes to discuss your application with him/her. Once you apply, standard screening and interviewing processes will apply.

Job Summary
The Senior Manager will lead a dynamic team of PCB designers responsible for the development of complex, high-performance PCBs for cutting-edge semiconductor products. This role requires both technical expertise in PCB fabrication and design.  This role also requires strong leadership skills to mentor and guide the team towards success. This person will work hand in hand with both Packaging, EM, and RFIC design teams in managing PCB design processes, fostering cross-functional collaboration, and delivering high-quality products in fast-paced environment. This position will report to the Director of NPI packaging and Printed Circuit Design.

Roles & Responsibilities
This position has responsibility for:
•    Lead, mentor, and grow a team of PCB designers, providing technical guidance and career development opportunities.
•    Foster a collaborative and innovative environment to ensure high levels of team performance.
•    Develop and maintain best practices for PCB design and review processes to optimize quality and efficiency.
•    Ensure designs comply with relevant industry standards (IPC, JEDEC, etc.), and are fully optimized for performance, reliability, and manufacturability.
•    Collaborate with suppliers, EM and IC design teams to define high performance PCB stackups and strive for standardization to maintain the best value to pSemi.
•    Manage multiple PCB design projects, ensuring that timelines, budgets, and quality targets are met.
•    Ongoing oversite of work in process, monitoring of backlog, and communication of status to balance business priorities within the PCB design environment. 
•    Drive continuous improvement in PCB design processes and tools to increase productivity and reduce design cycle time.
•    Manage PCB design tools, oversite of PCB tool licensing, and train team members to use tools.
•    Track, monitor, forecast, and report on PCB spend.

Minimum Qualifications (Experience and Skills)
•    Minimum of 7-10 years of experience in PCB design, with at least 3-5 years in a managerial or leadership role.
•    Strong leadership and team management skills, with a demonstrated ability to motivate and develop engineers.
•    Excellent problem-solving skills and the ability to work effectively under pressure.
•    Strong communication skills, both written and verbal, to interface with internal teams, suppliers, and customers.
•    Proficiency with PCB design tools such as Cadence Allegro(required), Zuken Design Force (preferred), or similar.
•    Hands on experience with printed circuit board layout from library development, schematic capture, parts placement, layout, and generation of all derived outputs necessary for fabrication          and assembly.
•    Familiarity with PCB manufacturing processes, including stack-up design, material selection, and an understanding of the sequence of manufacturing steps based on design construction.
•    Familiarity with EM and thermal simulation tools and the corresponding data exchange between tools.
•    Experience with supporting RMA investigations.
•    Experience with scripting and automation preferably with Cadence Skill code.

Preferred Qualifications 
•    Strong working knowledge and experience working with Asian subcontract bump and assembly suppliers
•    Familiarity with EM concepts and techniques for optimizing impedances, ground inductances, and isolation
•    Ability to use statistical analysis tools and concepts, including Design of Experiment methodology applied to process development.
•    Experience with Mechanical design tools such as AutoCad or solidworks.

Education Requirements
•    Bachelor’s degree in Electrical or Mechanical Engineering, Electronics, or a related field.

Work Environment
This job operates in a profe