Digital Integrated Circuit Design Engineer (Mid-Level, Senior or Lead)

Digital Integrated Circuit Design Engineer (Mid-Level, Senior or Lead)

Company:

The Boeing Company

Job ID:

00000438435

Date Posted:

2024-10-29

Location:

USA - Huntington Beach, CA

Job Description Qualifications:

We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. 

We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future!   #TheFutureIsBuiltHere #ChangeTheWorld

Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED’s large staff of microelectronics engineers conduct research and designs microelectronics hardware in support of these projects. 

We are seeking a Digital Integrated Circuit Design Engineer (Mid-Level, Senior or Lead) with experience developing complex, high-performance ASICs, FPGAs, and SoCs (e.g. custom multicore processors, digital signal processors) for military/aerospace or other safety-critical systems. This position will be located in Huntington Beach, California.

Position Responsibilities:

• Microarchitecture design and behavioral modeling (e.g. Matlab, Arm Socrates)

• RTL design (Verilog, VHDL),

• RTL verification (simulation, emulation),

• Integration of 3rd party IP (digital, mixed-signal), synthesis, place & route, design-for-test (DFT) insertion

• Static timing analysis / timing closure

• Power analysis, formal verification, and documentation development

This position is expected to be 100% onsite.  The selected candidate will be required to work onsite at one of the listed location options.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret clearance Post-Start is required.

 

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science

• 3+ years of experience in the design/development of integrated circuits

Preferred Qualifications (Desired Skills/Experience):

• 5+ years of related work experience or an equivalent combination of education and experience

• 10+ years of related work experience or an equivalent combination of education and experience

• Experience with design in analog, digital, mixed signal, RF, or SoC domains or experience designing and/or testing chips in more than one domain.

• Experience with industry standard Electronic Design Automation (EDA) tools and methodologies for digital ASIC/FPGA/SoC design and verification - e.g. Synopsys VCS, Design Compiler, ICC2, StarRC, PrimeTime, Tetramax, Formality; Cadence Genus, Innovus, Conformal, Joules, JasperGold; Mentor Graphics Questa, Tessent; Xilinx Vivado; and Universal Verification Methodology (UVM)

• Experience working on large-scale SoC design teams.

• Experience developing digital ASICs and SoCs in state-of-the-art semiconductor fabrication processes (e.g. 7/10/12/14/16nm FinFET CMOS, 22nm FDSOI CMOS)

• Experience developing digital or analog/mixed-signal ICs for extreme environment applications (e.g. radiation-hardened, extreme low/high temperatures, ultra-long lifetime)