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Advanced Packaging Engineer

SkyWater Technology
United Statesfull_timeVerifiedPosted 28 Jul 2025
💰 $165,000/yr($110,000/yr$165,000/yr)

About the role

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters or Florida location, employees join together to improve the world.


Explore what’s possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.


Step into the future. SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.


Are you bold thinking? Find your place on our team and help us change the world!


Job Summary:
We are seeking a highly skilled and motivated Packaging Engineer with hands-on experience in relevant technologies. The successful candidate will be responsible for the development, optimization, and sustaining of advanced packaging solutions.

Key Responsibilities:
◦ Lead process development and optimization of IC packaging processes (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, backgrinding / thinning).
◦ Define and execute DOE (Design of Experiments) for new materials and process evaluations.
◦ Establish process windows and control limits; develop process documentation including FMEA and control plans.
◦ Support new product introductions and ramp to production by collaborating closely with manufacturing and Product teams.
◦ Identify root causes and drive corrective actions for yield and reliability issues.
◦ Troubleshoot process issues, providing continuous improvements to yield, quality, and cycle time.
◦ Work with tool vendors and material suppliers to develop next generation technologies.
◦ Maintain clear documentation of process changes, results, and improvements through review & control processes.
◦ Present findings and suggest improvements to leadership teams.

Required Qualifications:
◦ At least 5-10 years of hands-on experience in semiconductor packaging process development (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, backgrinding / thinning).
◦ Knowledge of JEDEC reliability testing and associated failure modes & remedies.
◦ Familiarity with materials used in FOWLP/FOPLP ball attach and RDL is an added advantage.
◦ Solid understanding of failure analysis and troubleshooting with 8D, Six sigma processes.
◦ Strong problem-solving skills and a detail-oriented approach is needed.
◦ Ability to communicate technical concepts clearly to both technical and non-technical stakeholders.
◦ Strong teamwork, collaboration, and interpersonal skills is required.
◦ Ability to work in a fast-paced, cross-functional team environment.
◦ MS or PhD degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
◦ US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.


The annual salary range for this role is $110,000 - $165,000. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, lega

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Company

SkyWater Technology

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