DARPA Technical Advisor - Materials Science

Please Note: This position is contingent upon [additional funding].

ECS is seeking a highly skilled Material Scientist (Technical Advisor) with expertise in heterogeneous integration, heterogeneous material synthesis, and submicron CMOS circuits to provide technical guidance and support in advanced materials and packaging technologies. The successful candidate will play a pivotal role in advising on materials selection, silicon fabrication processes, and integration methodologies to achieve program objectives. They will collaborate closely with cross-functional teams and external partners to drive innovation and deliver cutting-edge solutions.

Tasking may include:

• Providing technical expertise in heterogeneous integration and material synthesis for advanced packaging solutions.
• Advising on submicron CMOS circuit layout design and optimization for high-performance applications.
• Analyzing materials properties and conducting in-depth assessments to inform technical decisions.
• Collaborating with cross-functional teams to ensure alignment and integration of materials and packaging technologies.
• Contributing to the development of design roadmaps based on materials science principles.
• Participating in technical meetings and discussions to provide insights and recommendations.
• Conducting gap analysis and identifying opportunities for technology advancement in materials and packaging.

Qualifications

• Active DOD secret clearance.
• US Citizenship required per contract.
• Master's degree in Material Science, Electrical Engineering, or related field, with a focus on silicon fabrication and materials science.
• Deep understanding of materials physics and chemistry, particularly in relation to silicon, heterogeneous integration, and heterogeneous material synthesis.
• Proficiency in analyzing materials properties and making technical judgments based on scientific principles.
• Experience in submicron CMOS circuit layout design and optimization.
• Strong problem-solving skills and ability to critically evaluate technical challenges.
• Excellent communication and collaboration skills to work effectively with cross-functional teams.
• Ability to provide technical leadership and guidance in materials science and packaging technologies.