About Eridu

Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver Faster AI. Today’s AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innovations across silicon, packaging, software, and systems to deliver an order of magnitude improvement in performance and unlock greater GPU utilization to speed training job completion times and tokens-per-second for more profitable inference. We do this while simultaneously reducing capital and power costs and improving reliability.

The company’s solutions and value proposition have been widely validated by leading hyperscalers.

Eridu has raised over $200M to date including its most recent, oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (the world’s leading micro-LED company). The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon, packaging, optics, software, and systems. Eridu is working with best-in-class supply chain partners including silicon, packaging and systems.

Visit our website eridu.ai to learn more.

Position Overview

Eridu is seeking a highly technical Mechanical Engineer with deep expertise in multiphysics modeling, thermo-mechanical behavior, and advanced packaging architecture.

This is not a conventional mechanical design position. You will serve as the physics authority responsible for developing predictive first-principles models, conducting nonlinear multiphysics simulations, and experimentally validating complex thermo-mechanical systems across their full life cycle.

You will lead the mechanical design for advanced semiconductor and system-level packaging operating at extreme power density and structural constraints. This includes sustained compression environments, thermal expansion mismatch, contact mechanics, and long-term material behavior under load.

This role requires intellectual rigor, experimental ownership, and the ability to translate physics into robust, manufacturable hardware.

Key Responsibilities

Multiphysics Modeling & Mechanical Architecture

·       Develop first-principles analytical models (hand calculations and reduced-order models) to predict thermo-mechanical behavior of complex mechanical stacks.

·       Own nonlinear FEA simulations involving contact mechanics, plasticity, creep, stress relaxation, and thermal-mechanical coupling.

·       Analyze and optimize mechanical stack-ups under sustained compression and thermal cycling.

·       Evaluate material behavior under long-term stress, including fatigue, creep, and reliability degradation.

·       Define mechanical architecture trade-offs balancing structural integrity, thermal performance, and manufacturability.

·       Drive predictive modeling to anticipate failure modes before physical hardware validation.

Experimental Design & Validation

·       Design and execute thermo-mechanical experiments to validate analytical and simulation models.

·       Develop instrumentation strategies (strain gauges, thermocouples, displacement sensors, load cells, displacement measurement systems, etc.) for high-fidelity measurements.

·       Characterize material behavior under compression, thermal cycling, creep, and fatigue conditions.

·       Correlate experimental data with nonlinear FEA simulations and calibrate models for predictive accuracy.

·       Define accelerated life testing methodologies to assess long-term mechanical and thermo-mechanical reliability.

·       Establish validation frameworks spanning prototype through high-volume production.

·       Drive data-based decision making acr