Proc Dev Engr Sr - SWFL Other Manufacturing

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters or Florida location, employees join together to improve the world.


Explore what’s possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.


Step into the future. SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.


Are you bold thinking? Find your place on our team and help us change the world!


Position Summary:
We are looking for a wafer level Electrical Test Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve electrical characterization processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). This includes in-line testing of wafers, final component and package test, RF characterization. Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.

Responsibilities:
• Test Development and Execution: Collaborate with the design and product engineering teams to develop test methodologies and test plans for advanced packaging development and production. Design and implement automated test programs and hardware setups using industry-standard test equipment. Execute tests on advanced packaging wafers at 300mm according to established test plans. Troubleshoot and resolve issues that arise during testing, ensuring accurate and reliable measurement data.
• Characterization: Conduct electrical characterization of advanced packaging wafers to analyze their performance. Perform DC and AC parametric measurements to verify device specifications and optimize performance.
• Data Analysis: Analyze test data and measurement results using statistical analysis software (e.g., JMP, Minitab, Python) to extract meaningful insights and identify trends. Use this data to evaluate device performance and provide feedback to design teams for continuous improvement.
• Test Automation: Continuously improve test methodologies and automation scripts to enhance efficiency and reduce testing time. Implement best practices for test automation and data management. Define and source equipment for final test depending on customer needs.
• Reliability Testing: Assist in reliability testing, including voltage and current stress, and environmental tests, to assess the long-term reliability of packaged devices. Participate in failure analysis activities when necessary.
• Documentation: Prepare clear and comprehensive test reports, documenting test procedures, results, and observations. Present findings to cross-functional teams and management as required.
• Collaboration: Work closely with product engineers, process engineers, and design teams to provide valuable input during the development cycle and support product validation efforts.
• Ensure maintenance and calibration of test equipment is up to date in collaboration with equipment team to guarantee accurate and consistent test results.
• Collaborate with yield engineering teams to analyze test data and identify potential yield-limiting factors in the Fan Out Wafer Level Packaging (FOWLP) and Silicon Interposer manufacturing process. Contribute to yield enhancement efforts through data-driven problem-solving.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:

Education: BS and 1-3 years or MS 0-1 years of engineering experience with on-wafer testing with a focus on CMOS, MEM