Job Details:

Job Description: 

• Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, thermal cycling, and reliability risks across a wide range of package architectures.

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on materials and properties to understand material behavior and reliability failure mechanisms.

• Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.

• Drive design-of-experiment studies and sensitivity analyses to understand key drivers of package performance and reliability

• Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy

• Develop solutions to problems utilizing formal education, experience and engineering judgment

• Communicate recommendation and solution space to internal and external customers. Responds to customer/client requests or events as they occur.

• Document and present simulation methodologies, results, and recommendations to both technical and executive audiences

• Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies

The candidate should also exhibit the following behavioral traits/skills:

• Strong communication skills across internal and external stakeholders and planning/prioritization skills for project success

• Ability to handle ambiguity and use appropriate skills (behavioral and/or technical) to drive clarity across stakeholders

• Willingness to lead and influence both external and internal teams

• Willingness to work independently with minimal supervision

• Technical problem-solving skills in a highly dynamic team environment

Note: This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• Master's Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 7+ years of industry experience

• -OR- PhD Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 4+ years of industry experience

Industry experience should include the following:

• Thermo-mechanical FEA modeling in semiconductor packaging domain

• At least one of the commercial FEA tools such as ANSYS, ABAQUS and COMSOL

• Advanced packaging technologies such as Foveros, EmIB, Cowos and Hybrid bonding.

• Semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.

Preferred Qualifications:

• Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma

• Familiarity with JEDEC reliability standards and qualification tests

• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows

• Experience in technical program management in any assembly or test functional area

• Experience in driving yield improvement activities for advanced package architectures

• Previous related work experience in a semiconductor foundry preferred 

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make ever