HI/Advanced Packaging Technology, Intern (PhD)

Are you a problem solver looking for a hands-on internship position with a market-leading company that will help develop your career and reward you intellectually and professionally?

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn.

At ADI, you will learn from the brightest minds who are here to help you grow and succeed. During your internship, you will make an impact through work on meaningful projects alongside a team of experts. Collaborating with colleagues in an environment of respect and responsibility, you will create connections that will become a part of your professional network.

ADI’s culture values aligned goals, work-life balance, continuous and life-long learning opportunities, and shared rewards. The internship program features various lunch-and-learn topics and social events with other interns and full-time employees.

At ADI, our goal is to develop our interns so they are the first to be considered for full-time roles.

Apply now for the opportunity to grow your career and help innovate ahead of what’s possible.

Position Overview: Analog Devices, Inc. (ADI) is seeking a motivated and talented PhD student to join our team as a Summer Intern. This role focuses on supporting the development of a multiyear Advanced Packaging business and technical strategy. The ideal candidate will have expertise or proficiency in: 

• Advanced Packaging, Heterogeneous Integration, Chiplets, Contact and Connectivity Scaling, Die to Wafer and Wafer to Wafer bonding, Substrate Engineering, Thermal Dissipation Methods in Packaging, Power Delivery Methods, Multi-Physics Modeling, Basic Circuit Design 

• Semiconductor Technology and Integration Methods, Packaging Methods, RF for Sensing and Communication, and Si Photonics I/O Technology 

You will assess the industry’s technical maturity, identify risks in the form of “gaps” that need addressing, and build proficiency to help ADI identify market opportunities through these methods. A working knowledge of project management practices is also desirable. 

Key Responsibilities: 

• Conduct market research and analysis to identify new technology directions and business opportunities in the advanced packaging sector. 

• Collaborate with cross-functional teams to gather and analyze data on emerging technologies and industry trends. 

• Support the creation of technical documentation and presentations for internal and external stakeholders. 

• Participate in technology learning sessions and contribute to knowledge sharing within the team. 

• Assist in the preparation of reports and proposals for strategic initiatives. 

Qualifications (in addition to the above): 

• Currently enrolled in a PhD program in Engineering, or a Semiconductor Science related field 

• Strong analytical and research skills. 

• Excellent written and verbal communication skills. 

• Ability to work independently and as part of a team. <