Mechanical Engineer - Electronics Packaging
ASMLAbout the role
Job Title
Mechanical Engineer - Electronics PackagingDegree:
BachelorWork Experience:
2-3 years, 4-9 yearsTravel:
NoWorkplace Types:
HybridJob Description:
Introduction
ASML US, including its affiliates and subsidiaries, bring together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. Our headquarters are in Veldhoven, Netherlands, and we have 18 office locations around the United States including main offices in Chandler, Arizona, San Jose and San Diego, California, Wilton, Connecticut, and Hillsboro, Oregon.
Job Mission
As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure. The position requires highly motivated, extremely organized and self-driven individuals.
This position may require access to controlled technology, as defined in the Export Administration Regulations (15 C.F.R. § 730, et seq.). As a condition of employment, qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require the Company to proceed with candidates who are immediately eligible to access controlled technology.
Job Description
Ability to design and document all aspects of the electrical infrastructure including:
AC, DC, Main power distribution (panel boards, boxes and cabinets)
Interconnect cables, bundles and connectors (harnessing)
Electronic racks, cabinets, control consoles
Interfacing with printed circuit board designs
Modeling of flex and rigid PWB’s including volumes and critical part locations
Experience designing electronic enclosure assemblies
Experience in sheet metal design
Experience designing for manufacturability (DFM) and developing assembly work instructions for low to medium volume products
Experience with 3D solid modeling for design conceptualization and realization (preferred experience using NX)
Experience supporting design fit check during integration & testing of electrical & electronic systems at the module, sub-system & system level
Knowledgeable of industry codes and standards ( i.e. NEC 70, NFPA 79, Machine Tool Standards)
Knowledge of FEA is a plus
Working knowledge of wiring diagrams and schematic diagrams
Working knowledge of design drafting best practices including geometric dimensioning
Perform dimensional and tolerance analysis as needed
Strong written and verbal communication skills required
Ability to write assembly, test procedures, test specifications and test reports
Experience
Minimum qualifications – the hired candidate must possess all of the minimum qualifications to be initially considered for the position including:
BS Engineering with a major in Mechanical Engineering and/or Industrial Engineering
2+ years of Mechanical design experience including Electronics Packaging (JG7)
Required technical skills
Mechanical design of electronic cabinets and racks
Cable routing, cable bundling and wiring design
Sheet metal design
Knowledge/hands-on experience with software/technical tools
3D CAD (NX preferred); Other parametric programs like SOLIDWORKS or Creo are also acceptable.
DMS (Teamcenter preferred); Other systems such as Windchill are also acceptable.
ERP (SAP preferred); Other ERP systems also acceptable.
Soft skill requirements
Strong English communication skills – both written and oral
Experience working in a project-oriented team
Ability to prioritize tasks
Personal Skills
Can observe and respond to people and situations and interact with others encountered in the course of work.
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