CVD Process Engineer - Wafer Bonding

About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. 

Come innovate with us!

Position Summary

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintains detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and to ensure smooth 24 / 7 wafer bonding operation.

Role and Responsibilities

• Equipment Setup and Operation

• • Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements

  • Ensure tool to tool matching across fabs and between tools

  • Develop and maintain Preventative Maintenance schedules and procedures

  • Ensure bonding meets device and process output specifications

  • Successfully transfer and qualify process from development fab to HVM facility

• Technical Troubleshooting

• • Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans

  • Provide clear updates and instructions to users and management regarding ongoing issues and resolutions

  • Maintain FMEA and manage RPN reduction activity

• Equipment and Process Continuous Improvement

• • Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput

  • Collaborate with vendors in evaluation and qualification on new bonding and de-bonding techniques.  

• Talent Development

• • Providing technical support and training to operators and technicians on equipment operation and procedures

  • Present key technical developments to SAS technical staff and management  

Skills and Qualifications

Required / Strongly Desired Knowledge/Skills:

• Knowledge and familiarity with hybrid bonging techniques and equipment

• Bachelor’s degree in Engineering or a related technical discipline.

• Minimum of 5 years of engineering experience in Fab Equipment management

• Minimum of 3 years in experience in wafer bonding and de-bonding equipment

• Experience in the semiconductor environment or in high volume advanced manufacturing

• Desire to take on technical challenges and shifting priorities in a fast paced cutting edge environment

• Able to work with others in a team-oriented culture

• Experience with data analysis: able to quickly analyze, summarize, and present data in an easy to understand format

• Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long term projects with daily sustaining.

• Ability to rapidly come up to speed with new computer applications and systems

• Able to work for several hours per day in a clean room environment

Desired Knowledge/Skills but not required:

• Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.

• Ability to manipulate and interpret equipment sensor data for the purpose of advanced equipment troubleshooting and setting up of controls for equipment sensors