Failure and Physical Analysis Engineer

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters or Florida location, employees join together to improve the world.


Explore what’s possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.


Step into the future. SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.


Are you bold thinking? Find your place on our team and help us change the world!


Position Summary:
We are looking for a hardworking and passionate Failure and Physical Analysis Engineer for our Florida Advanced Packaging site. In this role you will develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.

Responsibilities:
• Failure analysis in a development and manufacturing environment.
• Diagnose issues and integrate robust manufacturable process recipes for foundry customers using wafer fab metrology tools, FEI DIB (FIB and SEM).
• Prepare, image, and measure of fib x-section and manual cleave samples.
• Work from schematics, diagrams, written or verbal description, or layouts.
• Work on a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
• Utilize metrology tools to characterize and document process results for transfer to production.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process integration and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes.
• Monitor and improve electrical test parametrics through feedback and improvement of your processes.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:

Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.

Experience and Skills:
• Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.
• 4 years experience in failure analysis for yield improvement.
• Experience with ISO9001 or similar quality systems a plus.
• MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Direct hands on experience with Focused Ion Beam and Scanning Electron Microscope, EDS/EDX as tools in failure analysis in a wafer fab.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship is required- This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.


The annual salary range for this role is $91,600 - $137,400. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competit