Principal / Senior Principal Electromechanical Design Engineer
Northrop GrummanAbout the role
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We’re looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we’ll support yours of expanding your personal network and developing skills, whether you are new to the field, or an industry thought leader. At Northrop Grumman, you’ll have the resources, support, and team to do some of the best work of your career.
Northrop Grumman Mission Systems is seeking a Principal/Senior Principal Electromechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland and will require 100% on-site work.
What You'll Get to Do:
Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
Providing technical leadership and mentoring to less experienced personnel.
This position may be filled as a Principal Electromechanical Design Engineer or a Senior Principal Electromechanical Design Engineer.
This position is contingent on contract award and successfully transferring/obtaining final DoD Secret Clearance prior to start.
Basic Qualifications for Principal Electromechanical Design Engineer:
Bachelor’s degree with 5 years of experience, a master’s degree with 3 years of experience or a PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
U.S Citizenship required.
A final DoD Secret Clearance is required to start.
Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate\PWB layout
Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
Proficient with AutoCAD and/or Xpedition software
Familiarity with NX or other 3D modeling software
Basic Qualifications Senior Principal Electromechanical Design Engineer:
Bachelor’s degree with 8 years of experience, a master’s degree with 6 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
U.S Citizenship required.
A final DoD Secret Clearance is required to start.
Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate\PWB layout
Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
Proficient with AutoCAD and/or Xpedition software
Familiarity with NX or o
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