Senior eCAD Designer

The successful candidate will be required to design and layout DFM high density printed circuit boards in Cadence or Altium. Understand high density, high-speed, mixed-signal RF/analog/digital printed circuit board designs. Create and maintain components in a corporate-wide standard component library. Generate documentation for fabrication of printed circuit boards by external supplier. Generate assembly documentation for population of printed circuit board assemblies at Amentum Severn fabrication facilities. Calculate and route impedance-controlled transmission lines. Collaborate with manufacturing and establish and utilize design rules to verify manufacturability of designed printed circuit board. Correspond with PCB fab vendors to understand and implement vendor capabilities into designs. Efficiently manage time and resources to meet project deadlines. Thorough documentation of design processes, decisions, and changes to ensure clarity and traceability.

• Design and layout DFM high density printed circuit boards in Cadence or Altium.
• Understand high density, high-speed, mixed-signal RF/analog/digital printed circuit board designs.
• Layout high density printed circuit boards with high-speed, mixed-signal RF/analog/digital signals.
• Create and maintain components in a corporate-wide standard component library.
• Generate documentation for fabrication of printed circuit boards by external supplier.
• Generate assembly documentation for population of printed circuit board assemblies at Amentum Severn fabrication facilities.
• Calculate and route impedance-controlled transmission lines.
• Collaborate with manufacturing and establish and utilize design rules to verify manufacturability of designed printed circuit board.
• Correspond with PCB fab vendors to understand and implement vendor capabilities into designs.
• Efficiently manage time and resources to meet project deadlines.
• Thorough documentation of design processes, decisions, and changes to ensure clarity and traceability. 

This is what you will need:

• 15+ years of proficiency in using Cadence or Altium experience with EEE part creation and high-density PCB layout.                                             
• Ability to handle complex, multi-layer PCB designs, including high-speed and high-density interconnects.                                                                       
• 15+ year of experience working with key IPC standards to ensure high-quality and reliable electronic designs. (IPC-2220 Series, PC-7351, IPC-A-600, IPC-61, IPC-2615, IPC-2221).  
• 15+ years of experience working with high-speed, mixed-signal RF/analog/digital electrical schematics.
• Deep understanding of signal integrity, power integrity, and electromagnetic compatibility (EMC) considerations.
• Strong analytical skills to access and resolve complex technical High-Speed digital, RF, or EMI/EMC problems.
• Expertise in designing PCBs that are optimized for manufacturing, assembly, and testing processes.
• Proven track record of troubleshooting and resolving design issues, often through innovative solutions.
• Excellent communication skills to effectively convey design concepts, issues, and solutions to both technical and non-technical stakeholders.  
• Strong work ethic with a track record of completing tasks on schedule.

Preferred:

• Associates or bachelor’s degree in electrical engineering or a related field.
• Mechanical CAD experience (SolidWorks or comparable).
• A commitment to staying updated with the latest advancements in PCB design technology and methodologies.
• Familiarity with high-density surface mount devices and mixed bare die and surface mount devices.  
• Well-versed in IPC standards to ensure high-quality and reliab