Die Bond/Wire Bond Weekend Shift 5pm- 5:30am

 

Job Summary:

Performs basic and routine electronic assembly operations on components or subassemblies. Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.

 

Job Responsibility:

• Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach
• This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers.
• Clean PCB's and assemblies throughout process and after completion Maintain logs and paperwork and forms accurately consistent with company policy and practices.
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Other duties as assigned
• Performs a wide variety of electrical/mechanical product assembly operations on assemblies.
• Prepares assembly work to be accomplished by studying assembly instructions and following blueprint specifications.
• Using assembly drawings and related paperwork (Router, Pick List, bill of materials) to accompany parts through production flow
• Using written instructions to assemble, modify, rework, or reassemble units
• Performs basic and routine electronic assembly operations on components or subassemblies
• Maintains daily records and periodically summarizes activities
• May occasionally be required to work overtime
• Interface with Engineers and Program Managers
• Ability to operate and multi-task between 2 to 3 machines
• Knowledge of the scope of equipment is inherent in this position
• Process transactions on the Oracle (ERP) system

Required Qualification:

• Knowledge of the scope of equipment is inherent in this position
• Using written instructions to assemble, modify, rework, or reassemble units
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Interface with Engineers and Program Managers
• Ability to operate and multitask between 2 to 3 machines
• Maintains daily records and periodically summarizes activities
• May occasionally be required to work overtime
• Hand and eye coordination

Preferred Qualification:

• This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200 Die Attach machines, Yamaha Chip Shooter, Asymtek epoxy dispense, and EKRA printers.
• Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach

 

 

 

This position requires you to access information that is subject to U.S. export regulations.  You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.

 

Qualifications Why should you join Mercury Systems?

Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today's most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. Headquartered in Andover, Massachusetts, Mercury employs more than 2,300 people in 24 locations worldwide. To learn more, visit mrcy.com

Our Culture

We are committed to making Mercury a great place to work, no matter where our employees are located. We offer a casual and enjoyable atmosphere that allow