Senior Engineer, Semi Packaging Engineering

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

          

Employer: Analog Devices, Inc.  

Job Title: Senior Engineer, Semi Packaging Engineering

Job Requisition: 1010.1551.1 / R263306

Job Location: Wilmington, Massachusetts

Job Type: Full Time

Rate of Pay: $103,210 - $143,400 per year

[multiple openings]

Duties:                        

Work with cross-functional team to develop advanced integrated circuit ("IC") packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups. Perform component or system level mechanical stress and thermal simulations. Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification. Document manufacturing process flows and control plans for IC packages at company’s external suppliers. Work with quality and reliability groups to establish the reliability criteria and qualification plan for various end applications. Communicate complex engineering ideas to global teams simply and effectively, as rooted in engineering principles.

Requirements: Must have a Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent) and two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud.

Must also possess the following (quantitative experience requirements not applicable to this section):

• Demonstrated Expertise (“DE”) performing deep dive in 3D CAD tools (SolidWorks) and FEA software ANSYS. DE performing semiconductor IC or electronics assembly.
• DE in IC package design, optimization, and manufacturing.
• DE in IC package reliability requirements, failure analysis techniques, or assembly process issues.
• DE manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).
• DE in CAD tools such as Autocad.

Contact: Eligible for employee referral program. Apply online at https://www.analog.com/en/careers.html and Reference Position Number: R263306.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

          

Required Travel: No

          

Shift Type: 1st Shift/Days