R&D Principal Engineer, Novel Materials and Integration Solutions (6439)

Overview of Role

Join our dynamic Corporate Research team in San Jose as an R&D Principal Engineer, where you will explore novel materials and integration solutions, focusing on heat dissipation challenges in advanced chips and 3D structures. You will report to the Deputy Director in Corporate Research Memory Technology Department. We are seeking a passionate research engineer with expertise in material synthesis and characterization, particularly in deposition techniques like Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Physical Vapor Deposition (PVD). This role offers a rare opportunity to collaborate with internal teams in San Jose and Taiwan and partner with esteemed researchers at top universities. You'll be at the forefront of innovation, leading the charge in shaping the future of thermal materials and integration in this thrilling field.

 

Responsibilities

• Research, synthesis, and development of novel materials and their integration for thermal solutions in future ICs.
• Comprehensive characterization of materials and interfaces, including structural, chemical, electrical at the micro- and nano-scale.
• Study thermal properties of materials, structures, and interfaces.
• Collaborate effectively with cross-functional internal teams and external partners.
• Conduct work at in-house and off-site facilities.

 

Minimum Qualifications

• MS or PhD degree in a relevant field such as Physics, Material Science, Chemistry, or Electrical Engineering.
• Experienced in clean room processes and material deposition techniques such as CVD, ALD, and PVD.
• Experienced in a wide range of material characterization techniques.
• Deep knowledge of material science and surface chemistry for growth, etching, planarization, and bonding.
• Ability to work independently and collaborate with cross-functional teams.

 

Preferred Qualifications

• Experience in thermal characterization of materials and interfaces.
• Experience in one or more of physics-based simulation tools.
• Experience in setting up research equipment and programming on tool control and data collection.
• Experience in data analysis.
• Experience in thermal analysis at device, chip, or package level. 

 

Company Description

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

• The world’s leading dedicated semiconductor foundry
• The technology leader with a strong reputation for manufacturing excellence
• Advancing semiconductor manufacturing innovations to enable the future of technology

 

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

 

In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

 

Diversity statement

TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic inform